Thin film deposition on powder surfaces using atmospheric pressure discharge

The deposition of SiOx containing films on NaCl and KBr particles in dielectric barrier discharge under atmospheric pressure was investigated. As precursor hexamethyldisiloxane (HMDSO) and tetraethoxysilane (TEOS) in argon-oxygen gas mixtures were used. The deposited layers were studied by means of...

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Bibliographic Details
Main Authors: Brueser, V., Haehnel, M., Kersten, H.
Format: Conference Proceeding
Language:English
Subjects:
70 PLASMA PHYSICS AND FUSION TECHNOLOGY
ARGON
ATMOSPHERIC PRESSURE
CARBON
DEPOSITION
DIELECTRIC MATERIALS
ELECTRIC DISCHARGES
MIXTURES
OXYGEN
OXYGEN COMPOUNDS
PARTICLES
PLASMA
POTASSIUM BROMIDES
POWDERS
PRECURSOR
SCANNING ELECTRON MICROSCOPY
SILICON COMPOUNDS
SODIUM CHLORIDES
SURFACES
THIN FILMS
X-RAY PHOTOELECTRON SPECTROSCOPY
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Description
Summary:The deposition of SiOx containing films on NaCl and KBr particles in dielectric barrier discharge under atmospheric pressure was investigated. As precursor hexamethyldisiloxane (HMDSO) and tetraethoxysilane (TEOS) in argon-oxygen gas mixtures were used. The deposited layers were studied by means of light microscopy, SEM and XPS investigations. The particles could be completely covered by SiOx. With increasing oxygen content in the coating the carbon content decreases.
ISSN:0094-243X
1551-7616
DOI:10.1063/1.2134635