Influence of Shock Prestraining and Grain Size on the Dynamic-Tensile-Extrusion Response of Copper: Experiments and Simulation

The mechanical behavior of, and damage evolution in high-purity Cu is influenced by strain rate, temperature, stress state, grain size, and shock prestraining. The effects of grain size on the tensile mechanical response of high-purity Cu have been probed and are correlated with the evolution of the...

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Main Authors: Gray, G. T. III, Cerreta, E., Yablinsky, C. A., Addessio, L. B., Henrie, B. L., Sencer, B. H., Maloy, S. A., Trujillo, C. P., Lopez, M. F., Burkett, M., Maudlin, P. J.
Format: Conference Proceeding
Language:English
Subjects:
COMPARATIVE EVALUATIONS
COMPUTERIZED SIMULATION
CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY
COPPER
DAMAGE
DEFORMATION
DUCTILITY
EVOLUTION
GRAIN SIZE
PRESSURE DEPENDENCE
SHOCK WAVES
STRAIN RATE
STRAINS
STRESSES
TEMPERATURE DEPENDENCE
TOPOLOGY
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Summary:The mechanical behavior of, and damage evolution in high-purity Cu is influenced by strain rate, temperature, stress state, grain size, and shock prestraining. The effects of grain size on the tensile mechanical response of high-purity Cu have been probed and are correlated with the evolution of the substructure. The dynamic extrusion response of shock prestrained Cu demonstrates the significant influence of grain size on the large-strain dynamic tensile ductility of high-purity copper. Eulerian hydrocode simulations utilizing the Mechanical Threshold Stress constitutive model were performed to provide insight into the dynamic extrusion process. Quantitative comparisons between the predicted and measured deformation topologies and extrusion rates are presented.
ISSN:0094-243X
1551-7616
DOI:10.1063/1.2263424