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Physical Ion Sputtering At Glancing Angles As A Novel IC De-processing Technique

Failure analysis (de-processing) techniques are becoming more and more important in tackling integrated circuits (IC) process-related problems. Particularly, failure analysis of ICs requires opening and de-layering a chip in a layer by layer mode in order to find hidden defects. Selective chemical e...

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Main Authors:	Vyatkin, A. F., Zinenko, V. I.
Format:	Conference Proceeding
Language:	English
Subjects:	ATOMIC FORCE MICROSCOPY BEAMS CHARGED PARTICLES CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY CRYSTAL DEFECTS CRYSTAL STRUCTURE ELECTRON MICROSCOPY ELECTRONIC CIRCUITS ETCHING FAILURES INCIDENCE ANGLE INTEGRATED CIRCUITS ION BEAMS IONS LAYERS MATERIALS SCIENCE MECHANICAL POLISHING MICROELECTRONIC CIRCUITS MICROSCOPY PLASMA POLISHING PROCESSING SCANNING ELECTRON MICROSCOPY SPUTTERING SURFACE FINISHING
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creator	Vyatkin, A. F. Zinenko, V. I.
description	Failure analysis (de-processing) techniques are becoming more and more important in tackling integrated circuits (IC) process-related problems. Particularly, failure analysis of ICs requires opening and de-layering a chip in a layer by layer mode in order to find hidden defects. Selective chemical etching, reactive ion etching, plasma etching and chemical mechanical polishing or a combination of these techniques are traditionally used for de-processing of IC. In this work a novel technique which is physical ion sputtering at glancing incidence angles allowing precise information about possible reasons of IC failures occurring at different steps of IC processing is proposed.
doi_str_mv	10.1063/1.3548409
format	conference_proceeding
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identifier	ISSN: 0094-243X
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source	American Institute of Physics:Jisc Collections:Transitional Journals Agreement 2021-23 (Reading list)
subjects	ATOMIC FORCE MICROSCOPY BEAMS CHARGED PARTICLES CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY CRYSTAL DEFECTS CRYSTAL STRUCTURE ELECTRON MICROSCOPY ELECTRONIC CIRCUITS ETCHING FAILURES INCIDENCE ANGLE INTEGRATED CIRCUITS ION BEAMS IONS LAYERS MATERIALS SCIENCE MECHANICAL POLISHING MICROELECTRONIC CIRCUITS MICROSCOPY PLASMA POLISHING PROCESSING SCANNING ELECTRON MICROSCOPY SPUTTERING SURFACE FINISHING
title	Physical Ion Sputtering At Glancing Angles As A Novel IC De-processing Technique
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