Loading…

Encapsulated gate-all-around InAs nanowire field-effect transistors

We report the fabrication of lateral gate-all-around InAs nanowire field-effect transistors whose gate overlaps the source and drain electrodes and thus fully encapsulates the nanowire channel. They feature large drive current and transconductance that surpass those of conventional non-gate-overlap...

Full description

Saved in:
Bibliographic Details
Published in:Applied physics letters 2013-11, Vol.103 (21)
Main Authors: Sasaki, Satoshi, Tateno, Kouta, Zhang, Guoqiang, Suominen, Henri, Harada, Yuichi, Saito, Shiro, Fujiwara, Akira, Sogawa, Tetsuomi, Muraki, Koji
Format: Article
Language:English
Subjects:
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
cited_by cdi_FETCH-LOGICAL-c417t-4e102bd0867cc4b350a06e68f58d1767e0b200eb3da0e2deeae3b494550293e13
cites cdi_FETCH-LOGICAL-c417t-4e102bd0867cc4b350a06e68f58d1767e0b200eb3da0e2deeae3b494550293e13
container_end_page
container_issue 21
container_start_page
container_title Applied physics letters
container_volume 103
creator Sasaki, Satoshi
Tateno, Kouta
Zhang, Guoqiang
Suominen, Henri
Harada, Yuichi
Saito, Shiro
Fujiwara, Akira
Sogawa, Tetsuomi
Muraki, Koji
description We report the fabrication of lateral gate-all-around InAs nanowire field-effect transistors whose gate overlaps the source and drain electrodes and thus fully encapsulates the nanowire channel. They feature large drive current and transconductance that surpass those of conventional non-gate-overlap devices. The improved device characteristics can be attributed to the elimination of access resistance associated with ungated segments between the gate and source/drain electrodes. Our data also reveal a correlation between the normalized transconductance and the threshold voltage, which points to a beneficial effect of our wet-etching procedure performed prior to the atomic-layer-deposition of the gate dielectric.
doi_str_mv 10.1063/1.4832058
format article
fullrecord <record><control><sourceid>proquest_osti_</sourceid><recordid>TN_cdi_osti_scitechconnect_22254022</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>1494319877</sourcerecordid><originalsourceid>FETCH-LOGICAL-c417t-4e102bd0867cc4b350a06e68f58d1767e0b200eb3da0e2deeae3b494550293e13</originalsourceid><addsrcrecordid>eNqFkc1LxDAQxYMouK4e_A8KXvQQnXw17XFZ1g9Y8KLnkKZT7dJN1iRF_O-trujRyzwGfsx7wyPknME1g1LcsGtZCQ6qOiAzBlpTwVh1SGYAIGhZK3ZMTlLaTKviQszIcuWd3aVxsBnb4mWa1A4DtTGMvi0e_CIV3vrw3kcsuh6HlmLXoctFjtanPuUQ0yk56uyQ8OxH5-T5dvW0vKfrx7uH5WJNnWQ6U4kMeNNCVWrnZCMUWCixrDpVtUyXGqHhANiI1gLyFtGiaGQtlQJeC2RiTi72d0PKvUmuz-heXfB-ymM450oC5xN1uad2MbyNmLLZ9snhMFiPYUyGaQ1CCynhf3RyF6yutP7z_kU3YYx-etdwxmsFEr6pqz3lYkgpYmd2sd_a-GEYmK9-DDM__YhPJax_JQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2129504077</pqid></control><display><type>article</type><title>Encapsulated gate-all-around InAs nanowire field-effect transistors</title><source>American Institute of Physics:Jisc Collections:Transitional Journals Agreement 2021-23 (Reading list)</source><source>AIP_美国物理联合会现刊(与NSTL共建)</source><creator>Sasaki, Satoshi ; Tateno, Kouta ; Zhang, Guoqiang ; Suominen, Henri ; Harada, Yuichi ; Saito, Shiro ; Fujiwara, Akira ; Sogawa, Tetsuomi ; Muraki, Koji</creator><creatorcontrib>Sasaki, Satoshi ; Tateno, Kouta ; Zhang, Guoqiang ; Suominen, Henri ; Harada, Yuichi ; Saito, Shiro ; Fujiwara, Akira ; Sogawa, Tetsuomi ; Muraki, Koji</creatorcontrib><description>We report the fabrication of lateral gate-all-around InAs nanowire field-effect transistors whose gate overlaps the source and drain electrodes and thus fully encapsulates the nanowire channel. They feature large drive current and transconductance that surpass those of conventional non-gate-overlap devices. The improved device characteristics can be attributed to the elimination of access resistance associated with ungated segments between the gate and source/drain electrodes. Our data also reveal a correlation between the normalized transconductance and the threshold voltage, which points to a beneficial effect of our wet-etching procedure performed prior to the atomic-layer-deposition of the gate dielectric.</description><identifier>ISSN: 0003-6951</identifier><identifier>EISSN: 1077-3118</identifier><identifier>DOI: 10.1063/1.4832058</identifier><language>eng</language><publisher>Melville: American Institute of Physics</publisher><subject>Applied physics ; CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS ; CORRELATIONS ; CURRENTS ; DEPOSITION ; DIELECTRIC MATERIALS ; Drains ; ELECTRIC POTENTIAL ; ELECTRODES ; Encapsulation ; ETCHING ; FABRICATION ; FIELD EFFECT TRANSISTORS ; Gates ; INDIUM ARSENIDES ; Nanocomposites ; Nanomaterials ; Nanowires ; Semiconductor devices ; Threshold voltage ; Transconductance ; Transistors</subject><ispartof>Applied physics letters, 2013-11, Vol.103 (21)</ispartof><rights>2013 AIP Publishing LLC.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c417t-4e102bd0867cc4b350a06e68f58d1767e0b200eb3da0e2deeae3b494550293e13</citedby><cites>FETCH-LOGICAL-c417t-4e102bd0867cc4b350a06e68f58d1767e0b200eb3da0e2deeae3b494550293e13</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>230,314,780,782,784,885,27924,27925</link.rule.ids><backlink>$$Uhttps://www.osti.gov/biblio/22254022$$D View this record in Osti.gov$$Hfree_for_read</backlink></links><search><creatorcontrib>Sasaki, Satoshi</creatorcontrib><creatorcontrib>Tateno, Kouta</creatorcontrib><creatorcontrib>Zhang, Guoqiang</creatorcontrib><creatorcontrib>Suominen, Henri</creatorcontrib><creatorcontrib>Harada, Yuichi</creatorcontrib><creatorcontrib>Saito, Shiro</creatorcontrib><creatorcontrib>Fujiwara, Akira</creatorcontrib><creatorcontrib>Sogawa, Tetsuomi</creatorcontrib><creatorcontrib>Muraki, Koji</creatorcontrib><title>Encapsulated gate-all-around InAs nanowire field-effect transistors</title><title>Applied physics letters</title><description>We report the fabrication of lateral gate-all-around InAs nanowire field-effect transistors whose gate overlaps the source and drain electrodes and thus fully encapsulates the nanowire channel. They feature large drive current and transconductance that surpass those of conventional non-gate-overlap devices. The improved device characteristics can be attributed to the elimination of access resistance associated with ungated segments between the gate and source/drain electrodes. Our data also reveal a correlation between the normalized transconductance and the threshold voltage, which points to a beneficial effect of our wet-etching procedure performed prior to the atomic-layer-deposition of the gate dielectric.</description><subject>Applied physics</subject><subject>CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS</subject><subject>CORRELATIONS</subject><subject>CURRENTS</subject><subject>DEPOSITION</subject><subject>DIELECTRIC MATERIALS</subject><subject>Drains</subject><subject>ELECTRIC POTENTIAL</subject><subject>ELECTRODES</subject><subject>Encapsulation</subject><subject>ETCHING</subject><subject>FABRICATION</subject><subject>FIELD EFFECT TRANSISTORS</subject><subject>Gates</subject><subject>INDIUM ARSENIDES</subject><subject>Nanocomposites</subject><subject>Nanomaterials</subject><subject>Nanowires</subject><subject>Semiconductor devices</subject><subject>Threshold voltage</subject><subject>Transconductance</subject><subject>Transistors</subject><issn>0003-6951</issn><issn>1077-3118</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2013</creationdate><recordtype>article</recordtype><recordid>eNqFkc1LxDAQxYMouK4e_A8KXvQQnXw17XFZ1g9Y8KLnkKZT7dJN1iRF_O-trujRyzwGfsx7wyPknME1g1LcsGtZCQ6qOiAzBlpTwVh1SGYAIGhZK3ZMTlLaTKviQszIcuWd3aVxsBnb4mWa1A4DtTGMvi0e_CIV3vrw3kcsuh6HlmLXoctFjtanPuUQ0yk56uyQ8OxH5-T5dvW0vKfrx7uH5WJNnWQ6U4kMeNNCVWrnZCMUWCixrDpVtUyXGqHhANiI1gLyFtGiaGQtlQJeC2RiTi72d0PKvUmuz-heXfB-ymM450oC5xN1uad2MbyNmLLZ9snhMFiPYUyGaQ1CCynhf3RyF6yutP7z_kU3YYx-etdwxmsFEr6pqz3lYkgpYmd2sd_a-GEYmK9-DDM__YhPJax_JQ</recordid><startdate>20131118</startdate><enddate>20131118</enddate><creator>Sasaki, Satoshi</creator><creator>Tateno, Kouta</creator><creator>Zhang, Guoqiang</creator><creator>Suominen, Henri</creator><creator>Harada, Yuichi</creator><creator>Saito, Shiro</creator><creator>Fujiwara, Akira</creator><creator>Sogawa, Tetsuomi</creator><creator>Muraki, Koji</creator><general>American Institute of Physics</general><scope>AAYXX</scope><scope>CITATION</scope><scope>8FD</scope><scope>H8D</scope><scope>L7M</scope><scope>7QQ</scope><scope>7SP</scope><scope>7U5</scope><scope>JG9</scope><scope>OTOTI</scope></search><sort><creationdate>20131118</creationdate><title>Encapsulated gate-all-around InAs nanowire field-effect transistors</title><author>Sasaki, Satoshi ; Tateno, Kouta ; Zhang, Guoqiang ; Suominen, Henri ; Harada, Yuichi ; Saito, Shiro ; Fujiwara, Akira ; Sogawa, Tetsuomi ; Muraki, Koji</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c417t-4e102bd0867cc4b350a06e68f58d1767e0b200eb3da0e2deeae3b494550293e13</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2013</creationdate><topic>Applied physics</topic><topic>CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS</topic><topic>CORRELATIONS</topic><topic>CURRENTS</topic><topic>DEPOSITION</topic><topic>DIELECTRIC MATERIALS</topic><topic>Drains</topic><topic>ELECTRIC POTENTIAL</topic><topic>ELECTRODES</topic><topic>Encapsulation</topic><topic>ETCHING</topic><topic>FABRICATION</topic><topic>FIELD EFFECT TRANSISTORS</topic><topic>Gates</topic><topic>INDIUM ARSENIDES</topic><topic>Nanocomposites</topic><topic>Nanomaterials</topic><topic>Nanowires</topic><topic>Semiconductor devices</topic><topic>Threshold voltage</topic><topic>Transconductance</topic><topic>Transistors</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Sasaki, Satoshi</creatorcontrib><creatorcontrib>Tateno, Kouta</creatorcontrib><creatorcontrib>Zhang, Guoqiang</creatorcontrib><creatorcontrib>Suominen, Henri</creatorcontrib><creatorcontrib>Harada, Yuichi</creatorcontrib><creatorcontrib>Saito, Shiro</creatorcontrib><creatorcontrib>Fujiwara, Akira</creatorcontrib><creatorcontrib>Sogawa, Tetsuomi</creatorcontrib><creatorcontrib>Muraki, Koji</creatorcontrib><collection>CrossRef</collection><collection>Technology Research Database</collection><collection>Aerospace Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Ceramic Abstracts</collection><collection>Electronics &amp; Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Materials Research Database</collection><collection>OSTI.GOV</collection><jtitle>Applied physics letters</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Sasaki, Satoshi</au><au>Tateno, Kouta</au><au>Zhang, Guoqiang</au><au>Suominen, Henri</au><au>Harada, Yuichi</au><au>Saito, Shiro</au><au>Fujiwara, Akira</au><au>Sogawa, Tetsuomi</au><au>Muraki, Koji</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Encapsulated gate-all-around InAs nanowire field-effect transistors</atitle><jtitle>Applied physics letters</jtitle><date>2013-11-18</date><risdate>2013</risdate><volume>103</volume><issue>21</issue><issn>0003-6951</issn><eissn>1077-3118</eissn><abstract>We report the fabrication of lateral gate-all-around InAs nanowire field-effect transistors whose gate overlaps the source and drain electrodes and thus fully encapsulates the nanowire channel. They feature large drive current and transconductance that surpass those of conventional non-gate-overlap devices. The improved device characteristics can be attributed to the elimination of access resistance associated with ungated segments between the gate and source/drain electrodes. Our data also reveal a correlation between the normalized transconductance and the threshold voltage, which points to a beneficial effect of our wet-etching procedure performed prior to the atomic-layer-deposition of the gate dielectric.</abstract><cop>Melville</cop><pub>American Institute of Physics</pub><doi>10.1063/1.4832058</doi></addata></record>
fulltext fulltext
identifier ISSN: 0003-6951
ispartof Applied physics letters, 2013-11, Vol.103 (21)
issn 0003-6951
1077-3118
language eng
recordid cdi_osti_scitechconnect_22254022
source American Institute of Physics:Jisc Collections:Transitional Journals Agreement 2021-23 (Reading list); AIP_美国物理联合会现刊(与NSTL共建)
subjects Applied physics
CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS
CORRELATIONS
CURRENTS
DEPOSITION
DIELECTRIC MATERIALS
Drains
ELECTRIC POTENTIAL
ELECTRODES
Encapsulation
ETCHING
FABRICATION
FIELD EFFECT TRANSISTORS
Gates
INDIUM ARSENIDES
Nanocomposites
Nanomaterials
Nanowires
Semiconductor devices
Threshold voltage
Transconductance
Transistors
title Encapsulated gate-all-around InAs nanowire field-effect transistors
url http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-03T02%3A16%3A45IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_osti_&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Encapsulated%20gate-all-around%20InAs%20nanowire%20field-effect%20transistors&rft.jtitle=Applied%20physics%20letters&rft.au=Sasaki,%20Satoshi&rft.date=2013-11-18&rft.volume=103&rft.issue=21&rft.issn=0003-6951&rft.eissn=1077-3118&rft_id=info:doi/10.1063/1.4832058&rft_dat=%3Cproquest_osti_%3E1494319877%3C/proquest_osti_%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c417t-4e102bd0867cc4b350a06e68f58d1767e0b200eb3da0e2deeae3b494550293e13%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=2129504077&rft_id=info:pmid/&rfr_iscdi=true