Laser shock ignition of porous silicon based nano-energetic films

Nanoporous silicon films on a silicon wafer were loaded with sodium perchlorate and initiated using illumination with infrared laser pulses to cause laser thermal ignition and laser-generated shock waves. Using Photon Doppler Velocimetry, it was determined that these waves are weak stress waves with...

Full description

Saved in:
Bibliographic Details
Published in:Journal of applied physics 2014-08, Vol.116 (5)
Main Authors: Plummer, A., Kuznetsov, V. A., Gascooke, J., Shapter, J., Voelcker, N. H.
Format: Article
Language:English
Subjects:
Absorptivity
Applied physics
CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS
Energetic materials
FRACTURING
IGNITION
ILLUMINANCE
Infrared lasers
IRRADIATION
LASERS
LAYERS
PLASMA
PLASMA CONFINEMENT
POROUS MATERIALS
Porous silicon
PRESSURE RANGE MEGA PA 100-1000
PULSES
SHOCK WAVES
SILICON
Silicon films
Silicon substrates
Silicon wafers
Sodium perchlorate
SODIUM PERCHLORATES
Stress waves
STRESSES
SUBSTRATES
Velocimetry
Velocity measurement
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Nanoporous silicon films on a silicon wafer were loaded with sodium perchlorate and initiated using illumination with infrared laser pulses to cause laser thermal ignition and laser-generated shock waves. Using Photon Doppler Velocimetry, it was determined that these waves are weak stress waves with a threshold intensity of 131 MPa in the silicon substrate. Shock generation was achieved through confinement of a plasma, generated upon irradiation of an absorptive paint layer held against the substrate side of the wafer. These stress waves were below the threshold required for sample fracturing. Exploiting either the laser thermal or laser-generated shock mechanisms of ignition may permit use of pSi energetic materials in applications otherwise precluded due to their environmental sensitivity.
ISSN:0021-8979
1089-7550
DOI:10.1063/1.4892444