Tunable biaxial in-plane compressive strain in a Si nanomembrane transferred on a polyimide film

• Published in: Applied physics letters 2015-05, Vol.106 (21)
• Main Authors: Kim, Munho, Mi, Hongyi, Cho, Minkyu, Seo, Jung-Hun, Zhou, Weidong, Gong, Shaoqin, Ma, Zhenqiang
• Format: Article
• Language: English
• Subjects: ANNEALING; Applied physics; CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; Compressive properties; High temperature; Kapton (trademark); MATERIALS SCIENCE; Mathematical models; NANOSTRUCTURES; POLYAMIDES; Polyimide resins; RAMAN SPECTROSCOPY; SILICON; Strain distribution; STRAINS; Temperature; THERMODYNAMIC PROPERTIES; X ray spectra; X-RAY DIFFRACTION
• ISSN: 0003-6951; 1077-3118
• DOI: 10.1063/1.4922043

A method of creating tunable and programmable biaxial compressive strain in silicon nanomembranes (Si NMs) transferred onto a Kapton® HN polyimide film has been demonstrated. The programmable biaxial compressive strain (up to 0.54%) was generated utilizing a unique thermal property exhibited by the Kapton HN film, namely, it shrinks from its original size when exposed to elevated temperatures. The correlation between the strain and the annealing temperature was carefully investigated using Raman spectroscopy and high resolution X-ray diffraction. It was found that various amounts of compressive strains can be obtained by controlling the thermal annealing temperatures. In addition, a numerical model was used to evaluate the strain distribution in the Si NM. This technique provides a viable approach to forming in-plane compressive strain in NMs and offers a practical platform for further studies in strain engineering.