Development of high-vacuum planar magnetron sputtering using an advanced magnetic field geometry

A permanent magnet in a new magnetic field geometry (namely, with the magnetization in the radial direction) was fabricated and used for high-vacuum planar magnetron sputtering using Penning discharge. Because of the development of this magnet, the discharge current and deposition rate were increase...

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Bibliographic Details
Published in:Journal of vacuum science & technology. A, Vacuum, surfaces, and films Vacuum, surfaces, and films, 2015-11, Vol.33 (6)
Main Authors: Ohno, Takahiro, Yagyu, Daisuke, Saito, Shigeru, Ohno, Yasunori, Nakano, Hirofumi, Itoh, Masatoshi, Uhara, Yoshio, Miura, Tsutomu
Format: Article
Language:English
Subjects:
COMPARATIVE EVALUATIONS
CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY
DEPOSITION
DISTRIBUTION
ELECTRIC CURRENTS
ENGINEERING
MAGNETIC FIELDS
MAGNETIZATION
MAGNETRONS
PENNING DISCHARGES
PERMANENT MAGNETS
SPUTTERING
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Summary:A permanent magnet in a new magnetic field geometry (namely, with the magnetization in the radial direction) was fabricated and used for high-vacuum planar magnetron sputtering using Penning discharge. Because of the development of this magnet, the discharge current and deposition rate were increased two to three times in comparison with the values attainable with a magnet in the conventional geometry. This improvement was because the available space for effective discharge of the energetic electrons for the ionization increased because the magnetic field distribution increased in both the axial and radial directions of discharge.
ISSN:0734-2101
1520-8559
DOI:10.1116/1.4927442