Tensile behavior and flow stress anisotropy of accumulative roll bonded Cu-Nb nanolaminates

The flow stress, ductility, and in-plane anisotropy are evaluated for bulk accumulative roll bonded copper-niobium nanolaminates with layer thicknesses ranging from 1.8 μm to 15 nm. Uniaxial tensile tests conducted parallel to the rolling direction and transverse direction demonstrate that ductility...

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Bibliographic Details
Published in:Applied physics letters 2016-02, Vol.108 (5)
Main Authors: Nizolek, Thomas, Avallone, Jaclyn T., Pollock, Tresa M., Beyerlein, Irene J., Mara, Nathan A.
Format: Article
Language:English
Subjects:
ANISOTROPY
CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS
COPPER
CRYSTALLOGRAPHY
DUCTILITY
FLOW STRESS
LAYERS
NANOSTRUCTURES
NIOBIUM
PRESSURE RANGE MEGA PA
TEXTURE
THICKNESS
YIELD STRENGTH
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Summary:The flow stress, ductility, and in-plane anisotropy are evaluated for bulk accumulative roll bonded copper-niobium nanolaminates with layer thicknesses ranging from 1.8 μm to 15 nm. Uniaxial tensile tests conducted parallel to the rolling direction and transverse direction demonstrate that ductility generally decreases with decreasing layer thickness; however, at 30 nm, both high strengths (1200 MPa) and significant ductility (8%) are achieved. The yield strength increases monotonically with decreasing layer thickness, consistent with the Hall-Petch relationship, and significant in-plane flow stress anisotropy is observed. Taylor polycrystal modeling is used to demonstrate that crystallographic texture is responsible for the in-plane anisotropy and that the effects of texture dominate even at nanoscale layer thicknesses.
ISSN:0003-6951
1077-3118