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High-voltage MIS-gated GaN transistors
Transistors with a high electron mobility based on AlGaN/GaN epitaxial heterostructures are promising component types for creating high-power electronic devices of the next generation. This is due both to a high charge-carrier mobility in the transistor channel and a high electric durability of the...
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Published in: | Semiconductors (Woodbury, N.Y.) N.Y.), 2017-09, Vol.51 (9), p.1229-1232 |
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container_title | Semiconductors (Woodbury, N.Y.) |
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creator | Erofeev, E. V. Fedin, I. V. Fedina, V. V. Stepanenko, M. V. Yuryeva, A. V. |
description | Transistors with a high electron mobility based on AlGaN/GaN epitaxial heterostructures are promising component types for creating high-power electronic devices of the next generation. This is due both to a high charge-carrier mobility in the transistor channel and a high electric durability of the material making it possible to achieve high breakdown voltages. For use in power switching devices, normally off GaN transistors operating in the enrichment mode are required. To create normally off GaN transistors, the subgate region on the basis of
p
-GaN doped with magnesium is more often used. However, optimization of the
p
-GaN epitaxial-layer thickness and doping level makes it possible to achieve a threshold voltage close to
V
th
= +2 V for the on-mode of GaN transistors. In this study, it is shown that the use of a subgate MIS (metal–insulator–semiconductor) structure involved in
p
-GaN transistors results in an increase in the threshold voltage for the on-mode to
V
th
= +6.8 V, which depends on the subgate-insulator thickness in a wide range. In addition, it is established that the use of the MIS structure results in a decrease in the initial transistor current and the gate current in the on mode, which enables us to decrease the energy losses when controlling powerful GaN transistors. |
doi_str_mv | 10.1134/S106378261709010X |
format | article |
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p
-GaN doped with magnesium is more often used. However, optimization of the
p
-GaN epitaxial-layer thickness and doping level makes it possible to achieve a threshold voltage close to
V
th
= +2 V for the on-mode of GaN transistors. In this study, it is shown that the use of a subgate MIS (metal–insulator–semiconductor) structure involved in
p
-GaN transistors results in an increase in the threshold voltage for the on-mode to
V
th
= +6.8 V, which depends on the subgate-insulator thickness in a wide range. In addition, it is established that the use of the MIS structure results in a decrease in the initial transistor current and the gate current in the on mode, which enables us to decrease the energy losses when controlling powerful GaN transistors.</description><identifier>ISSN: 1063-7826</identifier><identifier>EISSN: 1090-6479</identifier><identifier>DOI: 10.1134/S106378261709010X</identifier><language>eng</language><publisher>Moscow: Pleiades Publishing</publisher><subject>Aluminum gallium nitrides ; CARRIER MOBILITY ; CHARGE CARRIERS ; Current carriers ; DOPED MATERIALS ; Electric charge ; ELECTRON MOBILITY ; Electronic devices ; ELECTRONIC EQUIPMENT ; ENERGY LOSSES ; Epitaxy ; GALLIUM NITRIDES ; Heterostructures ; LABELLING ; Liquor ; Magnesium ; Magnetic Materials ; Magnetism ; MASS SPECTROSCOPY ; MATERIALS SCIENCE ; MIS (semiconductors) ; NUCLEAR MAGNETIC RESONANCE ; Physics ; Physics and Astronomy ; Physics of Semiconductor Devices ; Semiconductor devices ; SEMICONDUCTOR MATERIALS ; Switching ; Thickness ; Threshold voltage ; TRANSISTORS</subject><ispartof>Semiconductors (Woodbury, N.Y.), 2017-09, Vol.51 (9), p.1229-1232</ispartof><rights>Pleiades Publishing, Ltd. 2017</rights><rights>COPYRIGHT 2017 Springer</rights><rights>Copyright Springer Science & Business Media 2017</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c383t-c3b6f54d25ad9e1c838474062533d73d6be2ffbdce31f7bbf95c4c0f2a7959543</citedby><cites>FETCH-LOGICAL-c383t-c3b6f54d25ad9e1c838474062533d73d6be2ffbdce31f7bbf95c4c0f2a7959543</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>230,314,780,784,885,27924,27925</link.rule.ids><backlink>$$Uhttps://www.osti.gov/biblio/22756376$$D View this record in Osti.gov$$Hfree_for_read</backlink></links><search><creatorcontrib>Erofeev, E. V.</creatorcontrib><creatorcontrib>Fedin, I. V.</creatorcontrib><creatorcontrib>Fedina, V. V.</creatorcontrib><creatorcontrib>Stepanenko, M. V.</creatorcontrib><creatorcontrib>Yuryeva, A. V.</creatorcontrib><title>High-voltage MIS-gated GaN transistors</title><title>Semiconductors (Woodbury, N.Y.)</title><addtitle>Semiconductors</addtitle><description>Transistors with a high electron mobility based on AlGaN/GaN epitaxial heterostructures are promising component types for creating high-power electronic devices of the next generation. This is due both to a high charge-carrier mobility in the transistor channel and a high electric durability of the material making it possible to achieve high breakdown voltages. For use in power switching devices, normally off GaN transistors operating in the enrichment mode are required. To create normally off GaN transistors, the subgate region on the basis of
p
-GaN doped with magnesium is more often used. However, optimization of the
p
-GaN epitaxial-layer thickness and doping level makes it possible to achieve a threshold voltage close to
V
th
= +2 V for the on-mode of GaN transistors. In this study, it is shown that the use of a subgate MIS (metal–insulator–semiconductor) structure involved in
p
-GaN transistors results in an increase in the threshold voltage for the on-mode to
V
th
= +6.8 V, which depends on the subgate-insulator thickness in a wide range. In addition, it is established that the use of the MIS structure results in a decrease in the initial transistor current and the gate current in the on mode, which enables us to decrease the energy losses when controlling powerful GaN transistors.</description><subject>Aluminum gallium nitrides</subject><subject>CARRIER MOBILITY</subject><subject>CHARGE CARRIERS</subject><subject>Current carriers</subject><subject>DOPED MATERIALS</subject><subject>Electric charge</subject><subject>ELECTRON MOBILITY</subject><subject>Electronic devices</subject><subject>ELECTRONIC EQUIPMENT</subject><subject>ENERGY LOSSES</subject><subject>Epitaxy</subject><subject>GALLIUM NITRIDES</subject><subject>Heterostructures</subject><subject>LABELLING</subject><subject>Liquor</subject><subject>Magnesium</subject><subject>Magnetic Materials</subject><subject>Magnetism</subject><subject>MASS SPECTROSCOPY</subject><subject>MATERIALS SCIENCE</subject><subject>MIS (semiconductors)</subject><subject>NUCLEAR MAGNETIC RESONANCE</subject><subject>Physics</subject><subject>Physics and Astronomy</subject><subject>Physics of Semiconductor Devices</subject><subject>Semiconductor devices</subject><subject>SEMICONDUCTOR MATERIALS</subject><subject>Switching</subject><subject>Thickness</subject><subject>Threshold voltage</subject><subject>TRANSISTORS</subject><issn>1063-7826</issn><issn>1090-6479</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2017</creationdate><recordtype>article</recordtype><recordid>eNp1kE1LAzEQhoMoWKs_wFtB8LY139kcS9G2UPVQBW8hm022W9pNTVLBf2_KCgoiA5lh8j4vMwPANYJjhAi9WyHIiSgxRwJKiODbCRigXBWcCnl6rDkpjv_n4CLGDYQIlYwOwO28bdbFh98m3djR42JVNDrZejTTT6MUdBfbmHyIl-DM6W20V995CF4f7l-m82L5PFtMJ8vCkJKk_FbcMVpjpmtpkSlJSQWFHDNCakFqXlnsXFUbS5ATVeUkM9RAh7WQTDJKhuCm9_UxtSqaNlmzNr7rrEkKY8HykvxHtQ_-_WBjUht_CF0eTCFJKJOUc5ZV417V6K1Vbed8XsjkqO2uzZ7Wtbk_YYjCoy3KAOoBE3yMwTq1D-1Oh0-FoDpeWf25cmZwz8Ss7Robfo3yL_QFOyJ7Wg</recordid><startdate>20170901</startdate><enddate>20170901</enddate><creator>Erofeev, E. V.</creator><creator>Fedin, I. V.</creator><creator>Fedina, V. V.</creator><creator>Stepanenko, M. V.</creator><creator>Yuryeva, A. V.</creator><general>Pleiades Publishing</general><general>Springer</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>OTOTI</scope></search><sort><creationdate>20170901</creationdate><title>High-voltage MIS-gated GaN transistors</title><author>Erofeev, E. V. ; Fedin, I. V. ; Fedina, V. V. ; Stepanenko, M. V. ; Yuryeva, A. V.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c383t-c3b6f54d25ad9e1c838474062533d73d6be2ffbdce31f7bbf95c4c0f2a7959543</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2017</creationdate><topic>Aluminum gallium nitrides</topic><topic>CARRIER MOBILITY</topic><topic>CHARGE CARRIERS</topic><topic>Current carriers</topic><topic>DOPED MATERIALS</topic><topic>Electric charge</topic><topic>ELECTRON MOBILITY</topic><topic>Electronic devices</topic><topic>ELECTRONIC EQUIPMENT</topic><topic>ENERGY LOSSES</topic><topic>Epitaxy</topic><topic>GALLIUM NITRIDES</topic><topic>Heterostructures</topic><topic>LABELLING</topic><topic>Liquor</topic><topic>Magnesium</topic><topic>Magnetic Materials</topic><topic>Magnetism</topic><topic>MASS SPECTROSCOPY</topic><topic>MATERIALS SCIENCE</topic><topic>MIS (semiconductors)</topic><topic>NUCLEAR MAGNETIC RESONANCE</topic><topic>Physics</topic><topic>Physics and Astronomy</topic><topic>Physics of Semiconductor Devices</topic><topic>Semiconductor devices</topic><topic>SEMICONDUCTOR MATERIALS</topic><topic>Switching</topic><topic>Thickness</topic><topic>Threshold voltage</topic><topic>TRANSISTORS</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Erofeev, E. V.</creatorcontrib><creatorcontrib>Fedin, I. V.</creatorcontrib><creatorcontrib>Fedina, V. V.</creatorcontrib><creatorcontrib>Stepanenko, M. V.</creatorcontrib><creatorcontrib>Yuryeva, A. V.</creatorcontrib><collection>CrossRef</collection><collection>OSTI.GOV</collection><jtitle>Semiconductors (Woodbury, N.Y.)</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Erofeev, E. V.</au><au>Fedin, I. V.</au><au>Fedina, V. V.</au><au>Stepanenko, M. V.</au><au>Yuryeva, A. V.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>High-voltage MIS-gated GaN transistors</atitle><jtitle>Semiconductors (Woodbury, N.Y.)</jtitle><stitle>Semiconductors</stitle><date>2017-09-01</date><risdate>2017</risdate><volume>51</volume><issue>9</issue><spage>1229</spage><epage>1232</epage><pages>1229-1232</pages><issn>1063-7826</issn><eissn>1090-6479</eissn><abstract>Transistors with a high electron mobility based on AlGaN/GaN epitaxial heterostructures are promising component types for creating high-power electronic devices of the next generation. This is due both to a high charge-carrier mobility in the transistor channel and a high electric durability of the material making it possible to achieve high breakdown voltages. For use in power switching devices, normally off GaN transistors operating in the enrichment mode are required. To create normally off GaN transistors, the subgate region on the basis of
p
-GaN doped with magnesium is more often used. However, optimization of the
p
-GaN epitaxial-layer thickness and doping level makes it possible to achieve a threshold voltage close to
V
th
= +2 V for the on-mode of GaN transistors. In this study, it is shown that the use of a subgate MIS (metal–insulator–semiconductor) structure involved in
p
-GaN transistors results in an increase in the threshold voltage for the on-mode to
V
th
= +6.8 V, which depends on the subgate-insulator thickness in a wide range. In addition, it is established that the use of the MIS structure results in a decrease in the initial transistor current and the gate current in the on mode, which enables us to decrease the energy losses when controlling powerful GaN transistors.</abstract><cop>Moscow</cop><pub>Pleiades Publishing</pub><doi>10.1134/S106378261709010X</doi><tpages>4</tpages></addata></record> |
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source | Springer Nature |
subjects | Aluminum gallium nitrides CARRIER MOBILITY CHARGE CARRIERS Current carriers DOPED MATERIALS Electric charge ELECTRON MOBILITY Electronic devices ELECTRONIC EQUIPMENT ENERGY LOSSES Epitaxy GALLIUM NITRIDES Heterostructures LABELLING Liquor Magnesium Magnetic Materials Magnetism MASS SPECTROSCOPY MATERIALS SCIENCE MIS (semiconductors) NUCLEAR MAGNETIC RESONANCE Physics Physics and Astronomy Physics of Semiconductor Devices Semiconductor devices SEMICONDUCTOR MATERIALS Switching Thickness Threshold voltage TRANSISTORS |
title | High-voltage MIS-gated GaN transistors |
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