A Review on Progress, Challenges, and Prospects of Material Jetting of Copper and Tungsten

Copper (Cu) and tungsten (W) possess exceptional electrical and thermal conductivity properties, making them suitable candidates for applications such as interconnects and thermal conductivity enhancements. Solution-based additive manufacturing (SBAM) offers unique advantages, including patterning c...

Full description

Saved in:
Bibliographic Details
Published in:Nanomaterials (Basel, Switzerland) Switzerland), 2023-08, Vol.13 (16)
Main Authors: Doddapaneni, V. Vinay K., Lee, Kijoon, Aysal, Havva Eda, Paul, Brian K., Pasebani, Somayeh, Sierros, Konstantinos A., Okwudire, Chinedum E., Chang, Chih-hung
Format: Article
Language:English
Subjects:
Chemistry
Materials Science
Physics
Science & Technology - Other Topics
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Copper (Cu) and tungsten (W) possess exceptional electrical and thermal conductivity properties, making them suitable candidates for applications such as interconnects and thermal conductivity enhancements. Solution-based additive manufacturing (SBAM) offers unique advantages, including patterning capabilities, cost-effectiveness, and scalability among the various methods for manufacturing Cu and W-based films and structures. In particular, SBAM material jetting techniques, such as inkjet printing (IJP), direct ink writing (DIW), and aerosol jet printing (AJP), present a promising approach for design freedom, low material wastes, and versatility as either stand-alone printers or integrated with powder bed-based metal additive manufacturing (MAM). Thus, this review summarizes recent advancements in solution-processed Cu and W, focusing on IJP, DIW, and AJP techniques. The discussion encompasses general aspects, current status, challenges, and recent research highlights. Furthermore, this paper addresses integrating material jetting techniques with powder bed-based MAM to fabricate functional alloys and multi-material structures. Finally, the factors influencing large-scale fabrication and potential prospects in this area are explored.
ISSN:2079-4991
2079-4991