Stress related anisotropy studies in DC-magnetron sputtered TbCo and TbFe films

A series of TbCo films and a series of TbFe films were prepared at different deposition powers and Ar sputtering pressures. It was found that anisotropy decreased with an increase of deposition power. Anisotropy also showed a peak within the range of 2.5 to 11.5 mtorr of Ar sputtering pressures. The...

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Bibliographic Details
Published in:IEEE (Institute of Electrical and Electronics Engineers) Transactions on Magnetics; (USA) 1989-09, Vol.25 (5), p.4018-4020
Main Authors: Cheng, S.-N., Kryder, M.H., Mathur, M.C.A.
Format: Article
Language:English
Subjects:
360101 - Metals & Alloys- Preparation & Fabrication
360104 - Metals & Alloys- Physical Properties
656003 - Condensed Matter Physics- Interactions between Beams & Condensed Matter- (1987-)
ALLOYS
Anisotropic magnetoresistance
ANISOTROPY
ARGON
COBALT ALLOYS
CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY
ELECTRON TUBES
ELECTRONIC EQUIPMENT
ELEMENTS
FABRICATION
FLUIDS
GASES
Glass
IRON ALLOYS
Magnetic field measurement
Magnetic films
MAGNETIC PROPERTIES
MAGNETRONS
MATERIALS SCIENCE
MICROWAVE EQUIPMENT
MICROWAVE TUBES
NONMETALS
Perpendicular magnetic anisotropy
PHYSICAL PROPERTIES
RARE EARTH ALLOYS
RARE GASES
SPUTTERING
STRESSES
Substrates
Temperature
TERBIUM ALLOYS
Thermal stresses
THIN FILMS
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Summary:A series of TbCo films and a series of TbFe films were prepared at different deposition powers and Ar sputtering pressures. It was found that anisotropy decreased with an increase of deposition power. Anisotropy also showed a peak within the range of 2.5 to 11.5 mtorr of Ar sputtering pressures. The perpendicular magnetic anisotropies (K/sub u/) of films still attached to their substrates and films removed from their substrates were compared. The percentage change in K/sub u/ which occurred when the film was removed from its substrate was correlated with the rise and fall of perpendicular anisotropy, although changes were also typically large at 2.5 mtorr of Ar sputtering pressure. Changes in K/sub u/ after removal from the substrate were as large as 46% in TbFe films deposited at 2.5 mtorr of Ar sputtering pressure. Larger percentage changes in K/sub u/ were found in DC-magnetron sputtered films than had been reported previously for RF-sputtered TbFe and TbCo films. The films deposited on thick polycarbonate substrates had the largest anisotropy and also suffered the largest percentage change in anisotropy when removed from the substrate.< >
ISSN:0018-9464
1941-0069
DOI:10.1109/20.42509