Feature‐Scale Fluid‐Based Erosion Modeling for Chemical‐Mechanical Polishing

A physics-based feature-scale erosion model is critical to forming a cohesive understanding of chemical-mechanical polishing because it can link chemical effects modeled on the particle scale to process conditions modeled at the wafer scale. Such a model is described here for polishing processes uti...

Full description

Saved in:
Bibliographic Details
Published in:Journal of the Electrochemical Society 1994-07, Vol.141 (7), p.1900-1904
Main Author: Runnels, Scott R.
Format: Article
Language:English
Subjects:
360601 - Other Materials- Preparation & Manufacture
CHEMICAL POLISHING
DISPERSIONS
EROSION
MATERIALS
MATERIALS SCIENCE
MATHEMATICAL MODELS
MECHANICAL POLISHING
MIXTURES
POLISHING
SEMICONDUCTOR MATERIALS
SLURRIES
SUBSTRATES
SURFACE FINISHING
SUSPENSIONS
Citations: Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:A physics-based feature-scale erosion model is critical to forming a cohesive understanding of chemical-mechanical polishing because it can link chemical effects modeled on the particle scale to process conditions modeled at the wafer scale. Such a model is described here for polishing processes utilizing a hydrodynamic slurry layer. The stresses induced by the flowing slurry on feature surfaces are computed and used in erosion models that incorporate fracture mechanics and chemistry empirically. Good agreement with experimental erosion profile data is demonstrated and the effect of hydrodynamic layer thickness and feature pattern density on planarization rate is investigated.
ISSN:0013-4651
1945-7111
DOI:10.1149/1.2055024