Formation of copper patterns on poly(tetrafluoroethylene) via radiation controlled chemical etching and chemical-vapor deposition

Patterned copper films have been deposited on poly(tetrafluoroethylene) (PTFE) in a three-step additive process. In the first step, a pattern is produced by cross linking the PTFE surface in selected areas by irradiation with either electrons or x rays at dose levels below those that are either visu...

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Bibliographic Details
Published in:Journal of applied physics 1992-12, Vol.72 (12), p.5941-5947
Main Authors: RYE, R. R, KNAPP, J. A, CHI, K.-M, HAMPDEN-SMITH, M. J, KODAS, T. T
Format: Article
Language:English
Subjects:
360101 - Metals & Alloys- Preparation & Fabrication
360601 - Other Materials- Preparation & Manufacture
Applied sciences
CHEMICAL COATING
CHEMICAL VAPOR DEPOSITION
Coating, metallization, dyeing
COPPER
DEPOSITION
ELECTRIC CONDUCTIVITY
ELECTRIC CONDUCTORS
ELECTRICAL PROPERTIES
ELECTROMAGNETIC RADIATION
ELECTRONS
ELEMENTARY PARTICLES
ELEMENTS
ETCHING
Exact sciences and technology
FABRICATION
FERMIONS
IONIZING RADIATIONS
LEPTONS
Machinery and processing
MATERIALS SCIENCE
METALS
PHYSICAL PROPERTIES
PHYSICAL RADIATION EFFECTS
Plastics
Polymer industry, paints, wood
POLYMERS
RADIATION EFFECTS
RADIATIONS
SURFACE COATING
SURFACE FINISHING
Technology of polymers
THIN FILMS
TRANSITION ELEMENTS
X RADIATION
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Description
Summary:Patterned copper films have been deposited on poly(tetrafluoroethylene) (PTFE) in a three-step additive process. In the first step, a pattern is produced by cross linking the PTFE surface in selected areas by irradiation with either electrons or x rays at dose levels below those that are either visually or spectroscopically apparent. The pattern is then developed by wet chemical etching in the second step in which only the nonirradiated areas are appreciably etched with sodium naphthalenide. In the final step, chemical-vapor deposition using the precursor (hexafluoroacetylacetonato) Cu(I) trimethylphosphine at 200 °C results in Cu deposition only on the nonirradiated areas of the surface. The Cu films are continuous with a resistivity of 4 μΩ cm, high purity as determined by Auger electron spectroscopy and x-ray photoelectron spectroscopy, and are sufficiently adherent to survive a Scotch tape test. Patterned feature sizes as small as 35 μm can be produced.
ISSN:0021-8979
1089-7550
DOI:10.1063/1.351902