Loading…
Thermal Conductivity of Porous Silicon Carbide Derived from Wood Precursors
Biomorphic silicon carbide (bioSiC), a novel porous ceramic derived from natural wood precursors, has potential applicability at high temperatures, particularly when rapid temperature changes occur. The thermal conductivity of bioSiC from five different precursors was experimentally determined using...
Saved in:
Published in: | Journal of the American Ceramic Society 2007-09, Vol.90 (9), p.2855-2862 |
---|---|
Main Authors: | , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
cited_by | cdi_FETCH-LOGICAL-c5007-e0fe023270cc54c50d238a84b4d38a3c88a2ad10835105942f375a57602ee5ba3 |
---|---|
cites | cdi_FETCH-LOGICAL-c5007-e0fe023270cc54c50d238a84b4d38a3c88a2ad10835105942f375a57602ee5ba3 |
container_end_page | 2862 |
container_issue | 9 |
container_start_page | 2855 |
container_title | Journal of the American Ceramic Society |
container_volume | 90 |
creator | Pappacena, K. E. Faber, K. T. Wang, H. Porter, W. D. |
description | Biomorphic silicon carbide (bioSiC), a novel porous ceramic derived from natural wood precursors, has potential applicability at high temperatures, particularly when rapid temperature changes occur. The thermal conductivity of bioSiC from five different precursors was experimentally determined using flash diffusivity and specific heat measurements at temperatures ranging from room temperature to 1100°C. The results were compared with values obtained from object‐oriented finite‐element analysis (OOF). OOF was also used to model and understand the heat‐flow paths through the complex bioSiC microstructures. |
doi_str_mv | 10.1111/j.1551-2916.2007.01777.x |
format | article |
fullrecord | <record><control><sourceid>proquest_osti_</sourceid><recordid>TN_cdi_osti_scitechconnect_938735</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>1335078021</sourcerecordid><originalsourceid>FETCH-LOGICAL-c5007-e0fe023270cc54c50d238a84b4d38a3c88a2ad10835105942f375a57602ee5ba3</originalsourceid><addsrcrecordid>eNqNkUtv1DAURi0EEkPhPxgkEJsEP-LYWaEqLdOWCgZRNMsrj-OoHjJxaydl5t_jNFWRWCC88ev4-NofQpiSnKb2YZtTIWjGKlrmjBCZEyqlzPdP0OJx4ylaEEJYJhUjz9GLGLdpSitVLNDnq2sbdrrDte-b0Qzuzg0H7Fu88sGPEX93nTO-x7UOG9dYfGKDu7MNboPf4bX3DV4Fa8YQfYgv0bNWd9G-euiP0I9Pp1f1WXb5dXleH19mRqQCM0taSxhnkhgjirTWMK60KjZFk3pulNJMN5QoLigRVcFaLoUWsiTMWrHR_Ai9nr0-Dg6icYM116nI3poBKq4kF4l5NzM3wd-ONg6wc9HYrtO9Te8CTktOCl4m8P0_wVQHo5OUJPTNX-jWj6FPTwVGZcUlq6aL1QyZ4GMMtoWb4HY6HJIJpsRgC1MwMAUDU2Jwnxjs09G3D34dje7aoHvj4p_zlSpLSWTiPs7cL9fZw3_74eK4Pr0fJ0M2G1wc7P7RoMNPKGX6bVh_WcK6rlcn5fIMvvHfMXO2JQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>217937295</pqid></control><display><type>article</type><title>Thermal Conductivity of Porous Silicon Carbide Derived from Wood Precursors</title><source>Wiley-Blackwell Read & Publish Collection</source><creator>Pappacena, K. E. ; Faber, K. T. ; Wang, H. ; Porter, W. D.</creator><creatorcontrib>Pappacena, K. E. ; Faber, K. T. ; Wang, H. ; Porter, W. D. ; Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States) ; High Temperature Materials Laboratory</creatorcontrib><description>Biomorphic silicon carbide (bioSiC), a novel porous ceramic derived from natural wood precursors, has potential applicability at high temperatures, particularly when rapid temperature changes occur. The thermal conductivity of bioSiC from five different precursors was experimentally determined using flash diffusivity and specific heat measurements at temperatures ranging from room temperature to 1100°C. The results were compared with values obtained from object‐oriented finite‐element analysis (OOF). OOF was also used to model and understand the heat‐flow paths through the complex bioSiC microstructures.</description><identifier>ISSN: 0002-7820</identifier><identifier>EISSN: 1551-2916</identifier><identifier>DOI: 10.1111/j.1551-2916.2007.01777.x</identifier><identifier>CODEN: JACTAW</identifier><language>eng</language><publisher>Malden, USA: Blackwell Publishing Inc</publisher><subject>09 BIOMASS FUELS ; Applied sciences ; Building materials. Ceramics. Glasses ; Ceramic industries ; CERAMICS ; Chemical industry and chemicals ; Exact sciences and technology ; Heat conductivity ; HEAT FLUX ; Heat transfer ; Mathematical analysis ; Miscellaneous ; Object-oriented programming ; Porosity ; Porous materials ; Precursors ; Silicon carbide ; SILICON CARBIDES ; SPECIFIC HEAT ; Technical ceramics ; THERMAL CONDUCTIVITY ; WOOD</subject><ispartof>Journal of the American Ceramic Society, 2007-09, Vol.90 (9), p.2855-2862</ispartof><rights>2008 INIST-CNRS</rights><rights>Copyright American Ceramic Society Sep 2007</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c5007-e0fe023270cc54c50d238a84b4d38a3c88a2ad10835105942f375a57602ee5ba3</citedby><cites>FETCH-LOGICAL-c5007-e0fe023270cc54c50d238a84b4d38a3c88a2ad10835105942f375a57602ee5ba3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>230,314,780,784,885,27924,27925</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=19866707$$DView record in Pascal Francis$$Hfree_for_read</backlink><backlink>$$Uhttps://www.osti.gov/biblio/938735$$D View this record in Osti.gov$$Hfree_for_read</backlink></links><search><creatorcontrib>Pappacena, K. E.</creatorcontrib><creatorcontrib>Faber, K. T.</creatorcontrib><creatorcontrib>Wang, H.</creatorcontrib><creatorcontrib>Porter, W. D.</creatorcontrib><creatorcontrib>Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)</creatorcontrib><creatorcontrib>High Temperature Materials Laboratory</creatorcontrib><title>Thermal Conductivity of Porous Silicon Carbide Derived from Wood Precursors</title><title>Journal of the American Ceramic Society</title><description>Biomorphic silicon carbide (bioSiC), a novel porous ceramic derived from natural wood precursors, has potential applicability at high temperatures, particularly when rapid temperature changes occur. The thermal conductivity of bioSiC from five different precursors was experimentally determined using flash diffusivity and specific heat measurements at temperatures ranging from room temperature to 1100°C. The results were compared with values obtained from object‐oriented finite‐element analysis (OOF). OOF was also used to model and understand the heat‐flow paths through the complex bioSiC microstructures.</description><subject>09 BIOMASS FUELS</subject><subject>Applied sciences</subject><subject>Building materials. Ceramics. Glasses</subject><subject>Ceramic industries</subject><subject>CERAMICS</subject><subject>Chemical industry and chemicals</subject><subject>Exact sciences and technology</subject><subject>Heat conductivity</subject><subject>HEAT FLUX</subject><subject>Heat transfer</subject><subject>Mathematical analysis</subject><subject>Miscellaneous</subject><subject>Object-oriented programming</subject><subject>Porosity</subject><subject>Porous materials</subject><subject>Precursors</subject><subject>Silicon carbide</subject><subject>SILICON CARBIDES</subject><subject>SPECIFIC HEAT</subject><subject>Technical ceramics</subject><subject>THERMAL CONDUCTIVITY</subject><subject>WOOD</subject><issn>0002-7820</issn><issn>1551-2916</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2007</creationdate><recordtype>article</recordtype><recordid>eNqNkUtv1DAURi0EEkPhPxgkEJsEP-LYWaEqLdOWCgZRNMsrj-OoHjJxaydl5t_jNFWRWCC88ev4-NofQpiSnKb2YZtTIWjGKlrmjBCZEyqlzPdP0OJx4ylaEEJYJhUjz9GLGLdpSitVLNDnq2sbdrrDte-b0Qzuzg0H7Fu88sGPEX93nTO-x7UOG9dYfGKDu7MNboPf4bX3DV4Fa8YQfYgv0bNWd9G-euiP0I9Pp1f1WXb5dXleH19mRqQCM0taSxhnkhgjirTWMK60KjZFk3pulNJMN5QoLigRVcFaLoUWsiTMWrHR_Ai9nr0-Dg6icYM116nI3poBKq4kF4l5NzM3wd-ONg6wc9HYrtO9Te8CTktOCl4m8P0_wVQHo5OUJPTNX-jWj6FPTwVGZcUlq6aL1QyZ4GMMtoWb4HY6HJIJpsRgC1MwMAUDU2Jwnxjs09G3D34dje7aoHvj4p_zlSpLSWTiPs7cL9fZw3_74eK4Pr0fJ0M2G1wc7P7RoMNPKGX6bVh_WcK6rlcn5fIMvvHfMXO2JQ</recordid><startdate>200709</startdate><enddate>200709</enddate><creator>Pappacena, K. E.</creator><creator>Faber, K. T.</creator><creator>Wang, H.</creator><creator>Porter, W. D.</creator><general>Blackwell Publishing Inc</general><general>Blackwell</general><general>Wiley Subscription Services, Inc</general><scope>BSCLL</scope><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7QQ</scope><scope>7SR</scope><scope>8FD</scope><scope>JG9</scope><scope>OTOTI</scope></search><sort><creationdate>200709</creationdate><title>Thermal Conductivity of Porous Silicon Carbide Derived from Wood Precursors</title><author>Pappacena, K. E. ; Faber, K. T. ; Wang, H. ; Porter, W. D.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c5007-e0fe023270cc54c50d238a84b4d38a3c88a2ad10835105942f375a57602ee5ba3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2007</creationdate><topic>09 BIOMASS FUELS</topic><topic>Applied sciences</topic><topic>Building materials. Ceramics. Glasses</topic><topic>Ceramic industries</topic><topic>CERAMICS</topic><topic>Chemical industry and chemicals</topic><topic>Exact sciences and technology</topic><topic>Heat conductivity</topic><topic>HEAT FLUX</topic><topic>Heat transfer</topic><topic>Mathematical analysis</topic><topic>Miscellaneous</topic><topic>Object-oriented programming</topic><topic>Porosity</topic><topic>Porous materials</topic><topic>Precursors</topic><topic>Silicon carbide</topic><topic>SILICON CARBIDES</topic><topic>SPECIFIC HEAT</topic><topic>Technical ceramics</topic><topic>THERMAL CONDUCTIVITY</topic><topic>WOOD</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Pappacena, K. E.</creatorcontrib><creatorcontrib>Faber, K. T.</creatorcontrib><creatorcontrib>Wang, H.</creatorcontrib><creatorcontrib>Porter, W. D.</creatorcontrib><creatorcontrib>Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)</creatorcontrib><creatorcontrib>High Temperature Materials Laboratory</creatorcontrib><collection>Istex</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Ceramic Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>OSTI.GOV</collection><jtitle>Journal of the American Ceramic Society</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Pappacena, K. E.</au><au>Faber, K. T.</au><au>Wang, H.</au><au>Porter, W. D.</au><aucorp>Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)</aucorp><aucorp>High Temperature Materials Laboratory</aucorp><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Thermal Conductivity of Porous Silicon Carbide Derived from Wood Precursors</atitle><jtitle>Journal of the American Ceramic Society</jtitle><date>2007-09</date><risdate>2007</risdate><volume>90</volume><issue>9</issue><spage>2855</spage><epage>2862</epage><pages>2855-2862</pages><issn>0002-7820</issn><eissn>1551-2916</eissn><coden>JACTAW</coden><abstract>Biomorphic silicon carbide (bioSiC), a novel porous ceramic derived from natural wood precursors, has potential applicability at high temperatures, particularly when rapid temperature changes occur. The thermal conductivity of bioSiC from five different precursors was experimentally determined using flash diffusivity and specific heat measurements at temperatures ranging from room temperature to 1100°C. The results were compared with values obtained from object‐oriented finite‐element analysis (OOF). OOF was also used to model and understand the heat‐flow paths through the complex bioSiC microstructures.</abstract><cop>Malden, USA</cop><pub>Blackwell Publishing Inc</pub><doi>10.1111/j.1551-2916.2007.01777.x</doi><tpages>8</tpages></addata></record> |
fulltext | fulltext |
identifier | ISSN: 0002-7820 |
ispartof | Journal of the American Ceramic Society, 2007-09, Vol.90 (9), p.2855-2862 |
issn | 0002-7820 1551-2916 |
language | eng |
recordid | cdi_osti_scitechconnect_938735 |
source | Wiley-Blackwell Read & Publish Collection |
subjects | 09 BIOMASS FUELS Applied sciences Building materials. Ceramics. Glasses Ceramic industries CERAMICS Chemical industry and chemicals Exact sciences and technology Heat conductivity HEAT FLUX Heat transfer Mathematical analysis Miscellaneous Object-oriented programming Porosity Porous materials Precursors Silicon carbide SILICON CARBIDES SPECIFIC HEAT Technical ceramics THERMAL CONDUCTIVITY WOOD |
title | Thermal Conductivity of Porous Silicon Carbide Derived from Wood Precursors |
url | http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-04T02%3A41%3A27IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_osti_&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Thermal%20Conductivity%20of%20Porous%20Silicon%20Carbide%20Derived%20from%20Wood%20Precursors&rft.jtitle=Journal%20of%20the%20American%20Ceramic%20Society&rft.au=Pappacena,%20K.%20E.&rft.aucorp=Oak%20Ridge%20National%20Lab.%20(ORNL),%20Oak%20Ridge,%20TN%20(United%20States)&rft.date=2007-09&rft.volume=90&rft.issue=9&rft.spage=2855&rft.epage=2862&rft.pages=2855-2862&rft.issn=0002-7820&rft.eissn=1551-2916&rft.coden=JACTAW&rft_id=info:doi/10.1111/j.1551-2916.2007.01777.x&rft_dat=%3Cproquest_osti_%3E1335078021%3C/proquest_osti_%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c5007-e0fe023270cc54c50d238a84b4d38a3c88a2ad10835105942f375a57602ee5ba3%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=217937295&rft_id=info:pmid/&rfr_iscdi=true |