Electrical performance improvements on RFICs using bump chip carrier packages as compared to standard thin shrink small outline packages

The electrical models of bump chip carrier (BCC) packages have been established based on the S-parameter measurement. When compared to the standard thin shrink small outline packages (TSSOPs), BCC packages show much smaller parasitics in the equivalent model. In the simulation, the insertion and ret...

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Bibliographic Details
Published in:IEEE transactions on advanced packaging 2001-11, Vol.24 (4), p.548-554
Main Authors: HORNG, Tzyy-Sheng, WU, Sung-Mao, CHIU, Chi-Tsung, HUNG, Chih-Pin
Format: Article
Language:English
Subjects:
Applied sciences
Body centered cubic lattice
Chip carriers
Circuit properties
Circuit simulation
Computer simulation
Electric variables measurement
Electric, optical and optoelectronic circuits
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Equivalence
Exact sciences and technology
Frequency
Gallium arsenide
Heterojunction bipolar transistors
Insertion loss
Microstrip
Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits
Monte Carlo methods
Packages
Packaging
Radiofrequency integrated circuits
Scattering parameters
Semiconductor device measurement
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Transistors
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Summary:The electrical models of bump chip carrier (BCC) packages have been established based on the S-parameter measurement. When compared to the standard thin shrink small outline packages (TSSOPs), BCC packages show much smaller parasitics in the equivalent model. In the simulation, the insertion and return losses for a packaged 50-/spl Omega/ microstrip line are calculated against frequency. BCC packages are also less lossy than TSSOPs over a wide frequency range. By setting a random variable with Gaussian distribution varied within a certain range for each equivalent circuit element of the packages, the Monte Carlo analysis has been performed to study the package effects on a GaAs heterojunction bipolar transistor (HBT). Again, BCC packages cause less decrement of HBT unity-gain bandwidth than TSSOPs.
ISSN:1521-3323
1557-9980
DOI:10.1109/6040.982843