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Interdiffusions and reactions in Cu/TiN/Ti/thermal SiO2 and Cu/TiN/Ti/hydrogen silsesquioxane multilayer structures

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Bibliographic Details
Published in:	Journal of the Electrochemical Society 2002-08, Vol.149 (8), p.G455-G460
Main Authors:	JENG, J. S, CHEN, J. S
Format:	Article
Language:	English
Subjects:	Condensed matter: structure, mechanical and thermal properties Diffusion interface formation Exact sciences and technology Physics Solid surfaces and solid-solid interfaces Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties)
Online Access:	Get full text
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