The vacuum wafer bonding technique as an alternative method for the fabrication of metal/semiconductor heterostructures

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Bibliographic Details
Main Authors: DESSEIN, K, ANIL KUMAR, P. S, NEMETH, S, DELAEY, L, BORGHS, G, DE BOECK, J
Format: Conference Proceeding
Language:English
Subjects:
Applied sciences
Electronics
Exact sciences and technology
Magnetoelectric, magnetostrictive, magnetoacoustic, magnetooptic and magnetothermal devices. Spintronics
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online Access:Get full text
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ISSN:0022-0248
1873-5002