Interfacial reactions between lead-free SnAgCu solder and Ni(P) surface finish on printed circuit boards

Transmission electron microscopy and scanning electron microscopy were employed to analyze the interfacial microstructure between Sn-Ag-Cu solder alloys and Ni(P)/Au metallizations. The intermetallic compound Cu/sub 6/Sn/sub 5/, containing a small amount of dissolved Ni, was found to form preferenti...

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Bibliographic Details
Published in:IEEE transactions on electronics packaging manufacturing 2002-07, Vol.25 (3), p.162-167
Main Authors: Kejun Zeng, Vuorinen, V., Kivilahti, J.K.
Format: Article
Language:English
Subjects:
Applied sciences
Boards
Coating
Coatings
Copper
Design. Technologies. Operation analysis. Testing
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Environmentally friendly manufacturing techniques
Exact sciences and technology
Finishes
Integrated circuits
Interface reactions
Intermetallic compounds
Lead
Microelectronic fabrication (materials and surfaces technology)
Microstructure
Nickel
Printed circuits
Scanning electron microscopy
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Solders
Surface finishing
Testing, measurement, noise and reliability
Tin
Transmission electron microscopy
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Summary:Transmission electron microscopy and scanning electron microscopy were employed to analyze the interfacial microstructure between Sn-Ag-Cu solder alloys and Ni(P)/Au metallizations. The intermetallic compound Cu/sub 6/Sn/sub 5/, containing a small amount of dissolved Ni, was found to form preferentially on the Ni coating. This compound layer served as a barrier for direct reaction of Sn with the Ni(P) coating. On the Ni(P) side, a nickel phosphide was identified. Thermodynamic evaluation of the Cu-Ni-Sn system was carried out to rationalize the enrichment of Cu at the solder/finish interface. Effects of the interfacial reactions on joint reliability are discussed.
ISSN:1521-334X
1558-0822
DOI:10.1109/TEPM.2002.801648