Loading…
Interfacial reactions between lead-free SnAgCu solder and Ni(P) surface finish on printed circuit boards
Transmission electron microscopy and scanning electron microscopy were employed to analyze the interfacial microstructure between Sn-Ag-Cu solder alloys and Ni(P)/Au metallizations. The intermetallic compound Cu/sub 6/Sn/sub 5/, containing a small amount of dissolved Ni, was found to form preferenti...
Saved in:
| Published in: | IEEE transactions on electronics packaging manufacturing 2002-07, Vol.25 (3), p.162-167 |
|---|---|
| Main Authors: | , , |
| Format: | Article |
| Language: | English |
| Subjects: | |
| Citations: | Items that this one cites Items that cite this one |
| Online Access: | Get full text |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| cited_by | cdi_FETCH-LOGICAL-c509t-14d21e5277f1d5e891b7955fc48ab687b0ab684ca4be3a5a3d05b2abc3ebe6973 |
|---|---|
| cites | cdi_FETCH-LOGICAL-c509t-14d21e5277f1d5e891b7955fc48ab687b0ab684ca4be3a5a3d05b2abc3ebe6973 |
| container_end_page | 167 |
| container_issue | 3 |
| container_start_page | 162 |
| container_title | IEEE transactions on electronics packaging manufacturing |
| container_volume | 25 |
| creator | Kejun Zeng Vuorinen, V. Kivilahti, J.K. |
| description | Transmission electron microscopy and scanning electron microscopy were employed to analyze the interfacial microstructure between Sn-Ag-Cu solder alloys and Ni(P)/Au metallizations. The intermetallic compound Cu/sub 6/Sn/sub 5/, containing a small amount of dissolved Ni, was found to form preferentially on the Ni coating. This compound layer served as a barrier for direct reaction of Sn with the Ni(P) coating. On the Ni(P) side, a nickel phosphide was identified. Thermodynamic evaluation of the Cu-Ni-Sn system was carried out to rationalize the enrichment of Cu at the solder/finish interface. Effects of the interfacial reactions on joint reliability are discussed. |
| doi_str_mv | 10.1109/TEPM.2002.801648 |
| format | article |
| fullrecord | <record><control><sourceid>proquest_pasca</sourceid><recordid>TN_cdi_pascalfrancis_primary_14426816</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>1158826</ieee_id><sourcerecordid>907990931</sourcerecordid><originalsourceid>FETCH-LOGICAL-c509t-14d21e5277f1d5e891b7955fc48ab687b0ab684ca4be3a5a3d05b2abc3ebe6973</originalsourceid><addsrcrecordid>eNqNkc9r10AQxYNYsFbvgpdF0OohX2d_JbvH8qXVQtWCFbwts5uJ3ZJu6m5C6X9vwrdQ8KA9zcB83mN4r6pecdhwDvbjxfH5l40AEBsDvFHmSbXPtTY1GCGerrvgtZTq57PqeSlXAFxpIfary9M0Ue4xRBxYJgxTHFNhnqZbosQGwq7uMxH7no5-bWdWxqGjzDB17Gt8f_6BlXlVE-tjiuWSjYnd5Lh4dizEHOY4MT9i7sqLaq_HodDL-3lQ_Tg5vth-rs--fTrdHp3VQYOdaq46wUmLtu15p8lY7lurdR-UQd-Y1sM6VEDlSaJG2YH2An2Q5KmxrTyoDne-N3n8PVOZ3HUsgYYBE41zcRZaa8FKvpDv_kkKqxoplPg_aAxIY-wjQGUaCeuTb_4Cr8Y5pyUXZ4xSUqt2dYMdFPJYSqbeLcleY75zHNzauVs7d2vnbtf5Inl774sl4NBnTCGWB51SojG8WbjXOy4S0cOZa2NEI_8AqzGz_w</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>884435479</pqid></control><display><type>article</type><title>Interfacial reactions between lead-free SnAgCu solder and Ni(P) surface finish on printed circuit boards</title><source>IEEE Electronic Library (IEL) Journals</source><creator>Kejun Zeng ; Vuorinen, V. ; Kivilahti, J.K.</creator><creatorcontrib>Kejun Zeng ; Vuorinen, V. ; Kivilahti, J.K.</creatorcontrib><description>Transmission electron microscopy and scanning electron microscopy were employed to analyze the interfacial microstructure between Sn-Ag-Cu solder alloys and Ni(P)/Au metallizations. The intermetallic compound Cu/sub 6/Sn/sub 5/, containing a small amount of dissolved Ni, was found to form preferentially on the Ni coating. This compound layer served as a barrier for direct reaction of Sn with the Ni(P) coating. On the Ni(P) side, a nickel phosphide was identified. Thermodynamic evaluation of the Cu-Ni-Sn system was carried out to rationalize the enrichment of Cu at the solder/finish interface. Effects of the interfacial reactions on joint reliability are discussed.</description><identifier>ISSN: 1521-334X</identifier><identifier>EISSN: 1558-0822</identifier><identifier>DOI: 10.1109/TEPM.2002.801648</identifier><identifier>CODEN: ITEPFL</identifier><language>eng</language><publisher>New York, NY: IEEE</publisher><subject>Applied sciences ; Boards ; Coating ; Coatings ; Copper ; Design. Technologies. Operation analysis. Testing ; Electronic equipment and fabrication. Passive components, printed wiring boards, connectics ; Electronics ; Environmentally friendly manufacturing techniques ; Exact sciences and technology ; Finishes ; Integrated circuits ; Interface reactions ; Intermetallic compounds ; Lead ; Microelectronic fabrication (materials and surfaces technology) ; Microstructure ; Nickel ; Printed circuits ; Scanning electron microscopy ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Solders ; Surface finishing ; Testing, measurement, noise and reliability ; Tin ; Transmission electron microscopy</subject><ispartof>IEEE transactions on electronics packaging manufacturing, 2002-07, Vol.25 (3), p.162-167</ispartof><rights>2003 INIST-CNRS</rights><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2002</rights><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c509t-14d21e5277f1d5e891b7955fc48ab687b0ab684ca4be3a5a3d05b2abc3ebe6973</citedby><cites>FETCH-LOGICAL-c509t-14d21e5277f1d5e891b7955fc48ab687b0ab684ca4be3a5a3d05b2abc3ebe6973</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1158826$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,780,784,27924,27925,54796</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=14426816$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Kejun Zeng</creatorcontrib><creatorcontrib>Vuorinen, V.</creatorcontrib><creatorcontrib>Kivilahti, J.K.</creatorcontrib><title>Interfacial reactions between lead-free SnAgCu solder and Ni(P) surface finish on printed circuit boards</title><title>IEEE transactions on electronics packaging manufacturing</title><addtitle>TEPM</addtitle><description>Transmission electron microscopy and scanning electron microscopy were employed to analyze the interfacial microstructure between Sn-Ag-Cu solder alloys and Ni(P)/Au metallizations. The intermetallic compound Cu/sub 6/Sn/sub 5/, containing a small amount of dissolved Ni, was found to form preferentially on the Ni coating. This compound layer served as a barrier for direct reaction of Sn with the Ni(P) coating. On the Ni(P) side, a nickel phosphide was identified. Thermodynamic evaluation of the Cu-Ni-Sn system was carried out to rationalize the enrichment of Cu at the solder/finish interface. Effects of the interfacial reactions on joint reliability are discussed.</description><subject>Applied sciences</subject><subject>Boards</subject><subject>Coating</subject><subject>Coatings</subject><subject>Copper</subject><subject>Design. Technologies. Operation analysis. Testing</subject><subject>Electronic equipment and fabrication. Passive components, printed wiring boards, connectics</subject><subject>Electronics</subject><subject>Environmentally friendly manufacturing techniques</subject><subject>Exact sciences and technology</subject><subject>Finishes</subject><subject>Integrated circuits</subject><subject>Interface reactions</subject><subject>Intermetallic compounds</subject><subject>Lead</subject><subject>Microelectronic fabrication (materials and surfaces technology)</subject><subject>Microstructure</subject><subject>Nickel</subject><subject>Printed circuits</subject><subject>Scanning electron microscopy</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Solders</subject><subject>Surface finishing</subject><subject>Testing, measurement, noise and reliability</subject><subject>Tin</subject><subject>Transmission electron microscopy</subject><issn>1521-334X</issn><issn>1558-0822</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2002</creationdate><recordtype>article</recordtype><recordid>eNqNkc9r10AQxYNYsFbvgpdF0OohX2d_JbvH8qXVQtWCFbwts5uJ3ZJu6m5C6X9vwrdQ8KA9zcB83mN4r6pecdhwDvbjxfH5l40AEBsDvFHmSbXPtTY1GCGerrvgtZTq57PqeSlXAFxpIfary9M0Ue4xRBxYJgxTHFNhnqZbosQGwq7uMxH7no5-bWdWxqGjzDB17Gt8f_6BlXlVE-tjiuWSjYnd5Lh4dizEHOY4MT9i7sqLaq_HodDL-3lQ_Tg5vth-rs--fTrdHp3VQYOdaq46wUmLtu15p8lY7lurdR-UQd-Y1sM6VEDlSaJG2YH2An2Q5KmxrTyoDne-N3n8PVOZ3HUsgYYBE41zcRZaa8FKvpDv_kkKqxoplPg_aAxIY-wjQGUaCeuTb_4Cr8Y5pyUXZ4xSUqt2dYMdFPJYSqbeLcleY75zHNzauVs7d2vnbtf5Inl774sl4NBnTCGWB51SojG8WbjXOy4S0cOZa2NEI_8AqzGz_w</recordid><startdate>20020701</startdate><enddate>20020701</enddate><creator>Kejun Zeng</creator><creator>Vuorinen, V.</creator><creator>Kivilahti, J.K.</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>RIA</scope><scope>RIE</scope><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><scope>8BQ</scope><scope>JG9</scope><scope>7TB</scope><scope>FR3</scope><scope>F28</scope></search><sort><creationdate>20020701</creationdate><title>Interfacial reactions between lead-free SnAgCu solder and Ni(P) surface finish on printed circuit boards</title><author>Kejun Zeng ; Vuorinen, V. ; Kivilahti, J.K.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c509t-14d21e5277f1d5e891b7955fc48ab687b0ab684ca4be3a5a3d05b2abc3ebe6973</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2002</creationdate><topic>Applied sciences</topic><topic>Boards</topic><topic>Coating</topic><topic>Coatings</topic><topic>Copper</topic><topic>Design. Technologies. Operation analysis. Testing</topic><topic>Electronic equipment and fabrication. Passive components, printed wiring boards, connectics</topic><topic>Electronics</topic><topic>Environmentally friendly manufacturing techniques</topic><topic>Exact sciences and technology</topic><topic>Finishes</topic><topic>Integrated circuits</topic><topic>Interface reactions</topic><topic>Intermetallic compounds</topic><topic>Lead</topic><topic>Microelectronic fabrication (materials and surfaces technology)</topic><topic>Microstructure</topic><topic>Nickel</topic><topic>Printed circuits</topic><topic>Scanning electron microscopy</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Solders</topic><topic>Surface finishing</topic><topic>Testing, measurement, noise and reliability</topic><topic>Tin</topic><topic>Transmission electron microscopy</topic><toplevel>online_resources</toplevel><creatorcontrib>Kejun Zeng</creatorcontrib><creatorcontrib>Vuorinen, V.</creatorcontrib><creatorcontrib>Kivilahti, J.K.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Xplore</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>METADEX</collection><collection>Materials Research Database</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Engineering Research Database</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><jtitle>IEEE transactions on electronics packaging manufacturing</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Kejun Zeng</au><au>Vuorinen, V.</au><au>Kivilahti, J.K.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Interfacial reactions between lead-free SnAgCu solder and Ni(P) surface finish on printed circuit boards</atitle><jtitle>IEEE transactions on electronics packaging manufacturing</jtitle><stitle>TEPM</stitle><date>2002-07-01</date><risdate>2002</risdate><volume>25</volume><issue>3</issue><spage>162</spage><epage>167</epage><pages>162-167</pages><issn>1521-334X</issn><eissn>1558-0822</eissn><coden>ITEPFL</coden><abstract>Transmission electron microscopy and scanning electron microscopy were employed to analyze the interfacial microstructure between Sn-Ag-Cu solder alloys and Ni(P)/Au metallizations. The intermetallic compound Cu/sub 6/Sn/sub 5/, containing a small amount of dissolved Ni, was found to form preferentially on the Ni coating. This compound layer served as a barrier for direct reaction of Sn with the Ni(P) coating. On the Ni(P) side, a nickel phosphide was identified. Thermodynamic evaluation of the Cu-Ni-Sn system was carried out to rationalize the enrichment of Cu at the solder/finish interface. Effects of the interfacial reactions on joint reliability are discussed.</abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/TEPM.2002.801648</doi><tpages>6</tpages></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 1521-334X |
| ispartof | IEEE transactions on electronics packaging manufacturing, 2002-07, Vol.25 (3), p.162-167 |
| issn | 1521-334X 1558-0822 |
| language | eng |
| recordid | cdi_pascalfrancis_primary_14426816 |
| source | IEEE Electronic Library (IEL) Journals |
| subjects | Applied sciences Boards Coating Coatings Copper Design. Technologies. Operation analysis. Testing Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Environmentally friendly manufacturing techniques Exact sciences and technology Finishes Integrated circuits Interface reactions Intermetallic compounds Lead Microelectronic fabrication (materials and surfaces technology) Microstructure Nickel Printed circuits Scanning electron microscopy Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Solders Surface finishing Testing, measurement, noise and reliability Tin Transmission electron microscopy |
| title | Interfacial reactions between lead-free SnAgCu solder and Ni(P) surface finish on printed circuit boards |
| url | http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-02T21%3A36%3A33IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_pasca&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Interfacial%20reactions%20between%20lead-free%20SnAgCu%20solder%20and%20Ni(P)%20surface%20finish%20on%20printed%20circuit%20boards&rft.jtitle=IEEE%20transactions%20on%20electronics%20packaging%20manufacturing&rft.au=Kejun%20Zeng&rft.date=2002-07-01&rft.volume=25&rft.issue=3&rft.spage=162&rft.epage=167&rft.pages=162-167&rft.issn=1521-334X&rft.eissn=1558-0822&rft.coden=ITEPFL&rft_id=info:doi/10.1109/TEPM.2002.801648&rft_dat=%3Cproquest_pasca%3E907990931%3C/proquest_pasca%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c509t-14d21e5277f1d5e891b7955fc48ab687b0ab684ca4be3a5a3d05b2abc3ebe6973%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=884435479&rft_id=info:pmid/&rft_ieee_id=1158826&rfr_iscdi=true |