Controllability of novel Sn0.95Au0.05 microbumps using interlaminated tin and gold layers for flip-chip interconnection

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Bibliographic Details
Published in:IEEE microwave and wireless components letters 2003-07, Vol.13 (7), p.256-258
Main Authors: ONODERA, Kiyomitsu, ISHII, Takao, AOYAMA, Shinji, TOKUMITSU, Masami
Format: Article
Language:English
Subjects:
Applied sciences
Circuit properties
Design. Technologies. Operation analysis. Testing
Electric, optical and optoelectronic circuits
Electronics
Exact sciences and technology
Integrated circuits
Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online Access:Get full text
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ISSN:1531-1309
2771-957X
1558-1764
2771-9588
DOI:10.1109/LMWC.2003.815180