Surface roughness induced by plasma etching of Si-containing polymers

Interfacial properties of polymers and their control become important at submicrometer scales, as polymers find widespread applications in industries ranging from micro- and nanoelectronics to optoelectronics and others fields. In this work, we address the issue of controlled modification of surface...

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Bibliographic Details
Published in:Journal of adhesion science and technology 2003-01, Vol.17 (8), p.1083-1091
Main Authors: Tserepi, A., Gogolides, E., Constantoudis, V., Cordoyiannis, G., Raptis, I., Valamontes, E. S.
Format: Article
Language:English
Subjects:
BILAYER RESISTS
Cross-disciplinary physics: materials science
rheology
Exact sciences and technology
Materials science
Physics
PLASMA TREATMENT
SILICON-CONTAINING POLYMERS
SURFACE ROUGHNESS
Surface treatments
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Summary:Interfacial properties of polymers and their control become important at submicrometer scales, as polymers find widespread applications in industries ranging from micro- and nanoelectronics to optoelectronics and others fields. In this work, we address the issue of controlled modification of surface topography of Si-containing polymers when subjected to oxygen-based plasma treatments. Treated surfaces were examined by atomic force microscopy to obtain surface topography and roughness of plasma-treated surfaces. Our experimental results indicate that an appropriate optimization of plasma chemistry and processing conditions allows, on one hand, small values of surface roughness, a result crucial for the potential use of these polymers for sub-100 nm lithography, and, on the other hand, desirable topography, applicable for example in sensor devices. Plasma processing conditions can be modified to result either in smooth surfaces (rms roughness < 1 nm) or in periodic structures of controlled roughness size and periodicity.
ISSN:0169-4243
1568-5616
DOI:10.1163/156856103322113805