Process integration of a direct-on-metal, non-etchback, κ= 2.5 spin-on polymer for the 0.18 μm CMOS technology node

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Bibliographic Details
Main Authors: SUM, J. C, RAY, G. W, MA, S, KAVARI, R, MACINNES, L. M, TREADWELL, C. A, DUNNE, J, HACKER, N. P, FIGGE, L. K, HENDRICKS, N
Format: Conference Proceeding
Language:English
Subjects:
Applied sciences
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Integrated circuits
Metallization, contacts, interconnects
device isolation
Microelectronic fabrication (materials and surfaces technology)
Microelectronics: LSI, VLSI, ULSI
integrated circuit fabrication technology
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online Access:Get full text
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DOI:10.1109/IITC.1999.787116