Cleans for Al vias in a 0.175 μm dual damascene process

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Bibliographic Details
Main Authors: GAMBINO, J, CLEVENGER, L, BRULEY, J, DOMENICUCCI, A, COSTRINI, G, SCHNABEL, F, RAVIKUMAR, R, DOBUZINSKY, D, IGGULDEN, R, DZIOBKOWSKI, C, WILDMAN, H, BENEDICT, J
Format: Conference Proceeding
Language:English
Subjects:
Applied sciences
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Integrated circuits
Metallization, contacts, interconnects
device isolation
Microelectronic fabrication (materials and surfaces technology)
Microelectronics: LSI, VLSI, ULSI
integrated circuit fabrication technology
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online Access:Get full text
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DOI:10.1109/IITC.1999.787123