Alternative bumping processes for DRAM-CSP

The usual assembly of CSP on printed circuit boards requires a relatively high volume of solder paste in a very small pitch. That's why a multiple step process is used with bumping of the interposer using pre-formed solder balls, with screen printing of solder paste on the substrate and with an...

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Bibliographic Details
Main Authors: Biedorf, R., Heinze, R., Wollanke, A., Wolter, K., Zerna, T., Plotzke, A.
Format: Conference Proceeding
Language:English
Subjects:
Apertures
Applied sciences
Assembly
Bonding
Design. Technologies. Operation analysis. Testing
Electronic components
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Exact sciences and technology
Integrated circuits
Integrated circuits by function (including memories and processors)
Laboratories
Manufacturing
Printed circuits
Printing
Productivity
Reflow soldering
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
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Summary:The usual assembly of CSP on printed circuit boards requires a relatively high volume of solder paste in a very small pitch. That's why a multiple step process is used with bumping of the interposer using pre-formed solder balls, with screen printing of solder paste on the substrate and with an reflow soldering step. In this paper three variants of bumping of CSP are discussed and some results of optimising the bumping and the assembly process of CSP are presented.
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.2002.1008299