Packaging of microwave integrated circuits operating beyond 100 GHz

Several methods of packaging high speed (75-330 GHz) InP HEMT MMIC devices are discussed. Coplanar wirebonding is presented with measured insertion loss of less than 0.5 dB and return loss better than -17 dB, from DC to 110 GHz. A motherboard/daughterboard packaging scheme is presented which support...

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Bibliographic Details
Main Authors: Daniel, E., Sokolov, V., Sommerfeldt, S., Bublitz, J., Olson, K., Gilbert, B., Samoska, L., Chow, D.
Format: Conference Proceeding
Language:English
Subjects:
Applied sciences
Circuit properties
Design. Technologies. Operation analysis. Testing
Electric, optical and optoelectronic circuits
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Exact sciences and technology
HEMTs
Indium phosphide
Insertion loss
Integrated circuit measurements
Integrated circuit packaging
Integrated circuits
Loss measurement
Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits
Microwave devices
Microwave integrated circuits
MMICs
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Transistors
Waveguide transitions
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Summary:Several methods of packaging high speed (75-330 GHz) InP HEMT MMIC devices are discussed. Coplanar wirebonding is presented with measured insertion loss of less than 0.5 dB and return loss better than -17 dB, from DC to 110 GHz. A motherboard/daughterboard packaging scheme is presented which supports minimum loss chains of MMICs using this coplanar wirebonding method.. Split-block waveguide packaging approaches are presented in G-band (140-220 GHz) with two types of MMIC-waveguide transitions: E-plane probe and antipodal finline.
DOI:10.1109/LECHPD.2002.1146777