Optical SMT-packaging for highly efficient and reliable fiber optic components including 1300nm VCSELs

In the presented packaging technology for optical SMT-components, a standard non-optical transparent mould compound is used. The optical access is realized by a prepared aperture in the metallic lead frame of the exposed die pad, which also enables at the same time a high precision fixation to the o...

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Bibliographic Details
Main Authors: Althaus, H.L., Melinde, M., Steinle, G., Weigert, M., Wietschorke, H.
Format: Conference Proceeding
Language:English
Subjects:
Apertures
Applied sciences
Assembly
Circuit properties
Design. Technologies. Operation analysis. Testing
Electric, optical and optoelectronic circuits
Electronics
Exact sciences and technology
Integrated circuits
Integrated optics. Optical fibers and wave guides
Lead
Optical and optoelectronic circuits
Optical devices
Optical fibers
Packaging
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Solid state circuits
Stimulated emission
Testing
Vertical cavity surface emitting lasers
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Description
Summary:In the presented packaging technology for optical SMT-components, a standard non-optical transparent mould compound is used. The optical access is realized by a prepared aperture in the metallic lead frame of the exposed die pad, which also enables at the same time a high precision fixation to the optical fiber. This principle made it possible to realize an optical clear plane or lensed window as submount surface to the inner electro-optical chips for focused light emission from/to the single mode-fiber. In using an overall non-optic transparent mould compound for packaging, the optical path is completely enclosed in a transparent solid state chip environment. The application of an innovative flip-chip and chip-on-chip technology on the base and the consequent use of wafer processes for hybrid assembling and test made it possible to realize an efficient assembling technology of different multichip-configurations of optical passive and active chips in optical-SMT-packages, e.g. "optical-TSSOP10" on a standard TSSOP-production line. The realisation of a rational well adapted SMT-package for a 1300 nm VCSEL-component, as an O-TSSOP10-VCSEL with coupled SMF access, shows the importance of the optical SMT-packaging for fiber optical applications with transmission rates up to 10 Gbit/s.
ISSN:0569-5503
DOI:10.1109/ECTC.2004.1319336