Low temperature embedded capacitor fabrication

Rapidly growing performance and mixed-signal integration is driving the need for product and component miniaturization in electronics applications. Integral passive technology is a potentially attractive solution to replace discrete passives. Capacitors are widely used for broad ranging applications...

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Bibliographic Details
Main Authors: Lok, B.K., Lu, A.C.W., Wai, L.L., Wei Fan, Wong, C.K., Wong, K.H., Chee, M.C.
Format: Conference Proceeding
Language:English
Subjects:
Applied sciences
Capacitance
Capacitors
Dielectric materials
Dielectric substrates
Dielectric thin films
Dielectric, amorphous and glass solid devices
Electronics
Exact sciences and technology
Fabrication
Frequency
Impedance
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Temperature
Thin film circuits
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Summary:Rapidly growing performance and mixed-signal integration is driving the need for product and component miniaturization in electronics applications. Integral passive technology is a potentially attractive solution to replace discrete passives. Capacitors are widely used for broad ranging applications including filtering, tuning and power decoupling. This paper presents the performance characterization of two low temperature processes that are compatible with organic substrates. RF characterization up to 10 GHz was performed to extract the impedance profile, effective capacitance and capacitance density parameters.
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.2004.1319390