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Low temperature embedded capacitor fabrication
Rapidly growing performance and mixed-signal integration is driving the need for product and component miniaturization in electronics applications. Integral passive technology is a potentially attractive solution to replace discrete passives. Capacitors are widely used for broad ranging applications...
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container_end_page | 535 Vol.1 |
container_issue | |
container_start_page | 531 |
container_title | |
container_volume | 1 |
creator | Lok, B.K. Lu, A.C.W. Wai, L.L. Wei Fan Wong, C.K. Wong, K.H. Chee, M.C. |
description | Rapidly growing performance and mixed-signal integration is driving the need for product and component miniaturization in electronics applications. Integral passive technology is a potentially attractive solution to replace discrete passives. Capacitors are widely used for broad ranging applications including filtering, tuning and power decoupling. This paper presents the performance characterization of two low temperature processes that are compatible with organic substrates. RF characterization up to 10 GHz was performed to extract the impedance profile, effective capacitance and capacitance density parameters. |
doi_str_mv | 10.1109/ECTC.2004.1319390 |
format | conference_proceeding |
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ispartof | 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.1, p.531-535 Vol.1 |
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language | eng |
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source | IEEE Xplore All Conference Series |
subjects | Applied sciences Capacitance Capacitors Dielectric materials Dielectric substrates Dielectric thin films Dielectric, amorphous and glass solid devices Electronics Exact sciences and technology Fabrication Frequency Impedance Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Temperature Thin film circuits |
title | Low temperature embedded capacitor fabrication |
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