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Low temperature embedded capacitor fabrication

Rapidly growing performance and mixed-signal integration is driving the need for product and component miniaturization in electronics applications. Integral passive technology is a potentially attractive solution to replace discrete passives. Capacitors are widely used for broad ranging applications...

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Main Authors: Lok, B.K., Lu, A.C.W., Wai, L.L., Wei Fan, Wong, C.K., Wong, K.H., Chee, M.C.
Format: Conference Proceeding
Language:English
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container_start_page 531
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creator Lok, B.K.
Lu, A.C.W.
Wai, L.L.
Wei Fan
Wong, C.K.
Wong, K.H.
Chee, M.C.
description Rapidly growing performance and mixed-signal integration is driving the need for product and component miniaturization in electronics applications. Integral passive technology is a potentially attractive solution to replace discrete passives. Capacitors are widely used for broad ranging applications including filtering, tuning and power decoupling. This paper presents the performance characterization of two low temperature processes that are compatible with organic substrates. RF characterization up to 10 GHz was performed to extract the impedance profile, effective capacitance and capacitance density parameters.
doi_str_mv 10.1109/ECTC.2004.1319390
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ispartof 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.1, p.531-535 Vol.1
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source IEEE Xplore All Conference Series
subjects Applied sciences
Capacitance
Capacitors
Dielectric materials
Dielectric substrates
Dielectric thin films
Dielectric, amorphous and glass solid devices
Electronics
Exact sciences and technology
Fabrication
Frequency
Impedance
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Temperature
Thin film circuits
title Low temperature embedded capacitor fabrication
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