Review and assessment of Pulsating Heat Pipe mechanism for high heat flux electronic cooling

Pulsating Heat Pipe (PHP) assisted heat sinks/chips present significantly lower spreading resistance, resulting in a higher heat removal capacity and more uniform temperature in electronic components and provide more packaging flexibilities. Theoretical and experimental investigations have shown tha...

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Bibliographic Details
Main Authors: Karimi, G., Culham, J.R.
Format: Conference Proceeding
Language:English
Subjects:
Applied sciences
Design. Technologies. Operation analysis. Testing
Electronic packaging thermal management
Electronics
Electronics cooling
Exact sciences and technology
Heat engines
Heat sinks
Heat transfer
Integrated circuits
Resistance heating
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Temperature
Thermal conductivity
Thermal resistance
Water heating
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Summary:Pulsating Heat Pipe (PHP) assisted heat sinks/chips present significantly lower spreading resistance, resulting in a higher heat removal capacity and more uniform temperature in electronic components and provide more packaging flexibilities. Theoretical and experimental investigations have shown that PHPs' heat spreading performance can be as high as that of diamond substrate. This article reviews some of the fundamental mechanisms involved in a PHP operation. The effectiveness of PHPs is presented in terms of heat transfer capacity, flexibilities, and limitations. The performance of a simple heat sink with and without an embedded heat pipe is also evaluated numerically.
DOI:10.1109/ITHERM.2004.1318252