Failure morphology after drop impact test of ball grid array (BGA) package with lead-free Sn-3.8Ag-0.7Cu and eutectic SnPb solders : Drop testing

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Bibliographic Details
Published in:IEEE transactions on electronics packaging manufacturing 2007, Vol.30 (1), p.49-53
Main Authors: JANG, Jin-Wook, DE SILVA, Ananda P, DRYE, James E, POST, Steve L, OWENS, Norman L, LIN, Jong-Kai, FREAR, Darrel R
Format: Article
Language:English
Subjects:
Applied sciences
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Integrated circuits
Microelectronic fabrication (materials and surfaces technology)
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online Access:Get full text
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ISSN:1521-334X
1558-0822