Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages: Lead-free electronic solders

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Bibliographic Details
Published in:Journal of materials science. Materials in electronics 2007, Vol.18 (1-3), p.247-258
Main Authors: CHAE, Seung-Hyun, XUEFENG ZHANG, LU, Kuan-Hsun, CHAO, Huang-Lin, HO, Paul S, MIN DING, PENG SU, UEHLING, Trent, RAMANATHAN, Lakshmi N
Format: Article
Language:English
Subjects:
Applied sciences
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Integrated circuits
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online Access:Get full text
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ISSN:0957-4522
1573-482X