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32-fibre 127 μm-pitch array and mirror-finish dicing technology for compact splitter module

We have successfully employed the high density 32-fibre 127 μm-pitch array assembly technology in the development of the compact splitter modules. In addition, an highly efficient mirror-finish dicing process has also been implemented.

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Bibliographic Details
Main Authors: Omori, T, Thiam, B.K, Hosoya, H, Yokosuka, H
Format: Conference Proceeding
Language:English
Subjects:
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Description
Summary:We have successfully employed the high density 32-fibre 127 μm-pitch array assembly technology in the development of the compact splitter modules. In addition, an highly efficient mirror-finish dicing process has also been implemented.
ISSN:0537-9989
DOI:10.1049/cp:19971458