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32-fibre 127 μm-pitch array and mirror-finish dicing technology for compact splitter module

We have successfully employed the high density 32-fibre 127 μm-pitch array assembly technology in the development of the compact splitter modules. In addition, an highly efficient mirror-finish dicing process has also been implemented.

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Main Authors: Omori, T, Thiam, B.K, Hosoya, H, Yokosuka, H
Format: Conference Proceeding
Language:English
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creator Omori, T
Thiam, B.K
Hosoya, H
Yokosuka, H
description We have successfully employed the high density 32-fibre 127 μm-pitch array assembly technology in the development of the compact splitter modules. In addition, an highly efficient mirror-finish dicing process has also been implemented.
doi_str_mv 10.1049/cp:19971458
format conference_proceeding
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identifier ISSN: 0537-9989
ispartof 11th International Conference on Integrated Optics and Optical Fibre Communications. 23rd European Conference on Optical Communications IOOC-ECOC97, 1997, p.224-227
issn 0537-9989
language eng
recordid cdi_pascalfrancis_primary_2038006
source IEEE Electronic Library (IEL) Conference Proceedings
subjects Applied sciences
Circuit properties
Electric, optical and optoelectronic circuits
Electronics
Exact sciences and technology
Fibre optics
Integrated optics. Optical fibers and wave guides
Integrated optoelectronics. Optoelectronic circuits
Optical and optoelectronic circuits
Optical beam splitters
Optical communication
Optical communication devices
Optical fibre fabrication, cladding, splicing, joining
title 32-fibre 127 μm-pitch array and mirror-finish dicing technology for compact splitter module
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