Thermomechanical modeling of 3D electronic packages: 3D chip technology

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Bibliographic Details
Published in:IBM journal of research and development 2008, Vol.52 (6), p.623-634
Main Authors: SRI-JAYANTHA, S. M, MCVICKER, G, BERNSTEIN, K, KNICKERBOCKER, J. U
Format: Article
Language:English
Subjects:
Applied sciences
Electronics
Exact sciences and technology
Fundamental areas of phenomenology (including applications)
Integrated circuits
Integrated circuits by function (including memories and processors)
Microelectronic fabrication (materials and surfaces technology)
Physics
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Solid mechanics
Structural and continuum mechanics
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ISSN:0018-8646
2151-8556