Through-silicon vias enable next-generation SiGe power amplifiers for wireless communications: 3D chip technology

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Bibliographic Details
Published in:IBM journal of research and development 2008, Vol.52 (6), p.635-648
Main Authors: JOSEPH, A. J, GILLIS, J. D, MCPARTLIN, M. J, DUNN, J, DOHERTY, M, LINDGREN, P. J, PREVITI-KELLY, R. A, MALLADI, R. M, WANG, P.-C, ERTURK, M, DING, H, GEBRESELASIE, E. G
Format: Article
Language:English
Subjects:
Applied sciences
Electronics
Exact sciences and technology
Integrated circuits
Integrated circuits by function (including memories and processors)
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online Access:Get full text
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ISSN:0018-8646
2151-8556