Flexible Gd2O2S:Tb scintillators pixelated with polyethylene microstructures for digital x-ray image sensors

• Published in: Journal of micromechanics and microengineering 2009-01, Vol.19 (1), p.015014-015014 (10)
• Main Authors: Jung, Im Deok, Cho, Min Kook, Lee, Sang Min, Bae, Kong Myeong, Jung, Phill Gu, Lee, Chi Hoon, Lee, Jae Min, Yun, Seungman, Kim, Ho Kyung, Kim, Seong Sik, Ko, Jong Soo
• Format: Article
• Language: English
• Subjects: Applied sciences; Electronics; Exact sciences and technology; Instruments, apparatus, components and techniques common to several branches of physics and astronomy; Machinery and processing; Mechanical engineering. Machine design; Mechanical instruments, equipment and techniques; Microelectronic fabrication (materials and surfaces technology); Micromechanical devices and systems; Moulding; Physics; Plastics; Polymer industry, paints, wood; Precision engineering, watch making; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Technology of polymers
• ISSN: 0960-1317; 1361-6439
• DOI: 10.1088/0960-1317/19/1/015014

Flexible scintillators for digital x-ray image sensors were designed, fabricated and characterized. In these scintillaotrs, terbium-doped gadolinium oxysulfide (Gd2O2S:Tb) scintillator pixels were embedded into a polyethylene (PE) substrate. To evaluate the difference in the spatial resolution according to the pixel size, we designed three scintillators with pixels of different pitch sizes: 50 mum pitch size (P50), 100 mum pitch size (P100) and 200 mum pitch size (P200). Because of the high flexibility and good formability, polyethylene was used as the substrate of the scintillator. To fabricate nickel micromolds with high-aspect-ratio microstructures, two microfabrication techniques were employed: silicon dry-etching using a deep reactive ion etching (DRIE) process and nickel electroforming. The pixelated PE microstructures were fabricated by a hot embossing process. Because the solution-type Gd2O2S:Tb precursor can be handled at room temperature, Gd2O2S:Tb was used as the scintillator material. The measured sensitivities of the P50 and P100 models were, respectively, about 65% and 97% of that of the P200 model. The lower sensitivity values of the models with a small pitch size were due to two factors, such as the different pixel heights and the different fill factors. Because a scintillator with a small pixel size has a low fill factor, the sensitivity of the scintillator decreases as the pixel size decreases. The fill factors of the P50, P100 and P200 models were 36%, 49% and 56.25%, respectively. On the other hand, the spatial resolution of the scintillator increases as the pixel size decreases. Therefore, P50 gave the best spatial resolution among the designed models. The spatial frequency at 10% of the modulation transfer function (MTF) with P50 was 13.5 mm-1, while that with P200 was 10.0 mm-1. The resolution pattern and the tooth x-ray images obtained from a scintillator with a smaller pixel size was also clearer than that obtained from a scintillator with a larger pixel size. PE-based flexible Gd2O2S:Tb scintillators can be utilized directly in flexible x-ray image sensors.