A Model of BGA Thermal Vias as an Example of Lumped Parameter Analysis in Thermal Modeling of SiPs and Stacked Die Packages : Simplified models reduce the time and cost of analyzing the thermal behavior of stacked chip packages by describing them as networks of thermal resistances: 3-D Integration Technologies

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Bibliographic Details
Published in:Proceedings of the IEEE 2009, Vol.97 (1), p.70-77
Main Authors: COLOMBO, Luigi Pietro Maria, PALEARI, Davide, PETRUSHIN, Alexey
Format: Article
Language:English
Subjects:
Applied sciences
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Integrated circuits
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online Access:Get full text
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ISSN:0018-9219
1558-2256