Flip Chip Bonding of 68 x 68 MWIR LED Arrays

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Bibliographic Details
Published in:IEEE transactions on electronics packaging manufacturing 2009, Vol.32 (1), p.9-13
Main Authors: CHANDRA DAS, Naresh, TAYSING-LARA, Monica, ANDERSON OLVER, Kimberley, KIAMILEV, Fouad, PRINEAS, J. P, OLESBERG, J. T, KOERPERICK, E. J, MURRAY, L. M, BOGGESS, Tom F
Format: Article
Language:English
Subjects:
Applied sciences
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Integrated circuits
Optoelectronic devices
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online Access:Get full text
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ISSN:1521-334X
1558-0822
DOI:10.1109/TEPM.2008.2005062