Wafer-Level Packaging With Soldered Stress-Engineered Micro-Springs : Wafer-level packaging

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Bibliographic Details
Published in:IEEE transactions on advanced packaging 2009, Vol.32 (2), p.372-378
Main Authors: CHOW, Eugene M, FORK, David K, CHUA, Christopher L, VAN SCHUYLENBERGH, Koenraad, HANTSCHEL, Thomas
Format: Article
Language:English
Subjects:
Applied sciences
Design. Technologies. Operation analysis. Testing
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Exact sciences and technology
Integrated circuits
Microelectronic fabrication (materials and surfaces technology)
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online Access:Get full text
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ISSN:1521-3323
1557-9980