Molded chip scale package for high pin count

A unique molded chip scale package (CSP) associated 1024 pin counts has been developed. This package has the "bare die soldering" feature, that means highest mount density and enhanced electrical characteristic, and the "robust package" feature, that means easy to handle, to test...

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Bibliographic Details
Published in:IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging packaging, and manufacturing technology. Part B, Advanced packaging, 1998-02, Vol.21 (1), p.28-34
Main Authors: Baba, S., Tomita, Y., Matsuo, M., Matsushima, H., Ueda, N., Nakagawa, O.
Format: Article
Language:English
Subjects:
Applied sciences
Chip scale packaging
Cities and towns
Conductors
Costs
Electric variables
Electrodes
Electronics
Exact sciences and technology
Large scale integration
Microelectronic fabrication (materials and surfaces technology)
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Soldering
Testing
Wiring
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Description
Summary:A unique molded chip scale package (CSP) associated 1024 pin counts has been developed. This package has the "bare die soldering" feature, that means highest mount density and enhanced electrical characteristic, and the "robust package" feature, that means easy to handle, to test and to standardize such as known good die (KGD). The wiring conductor patterns made of copper realized enhanced electrical characteristic. The solder bumping process with screen printing technique, was applied with cost competitiveness. And the transfer molding process produced high reliable package.
ISSN:1070-9894
1558-3686
DOI:10.1109/96.659503