A pseudo 3D glass microprobe array: glass microprobe with embedded silicon for alignment and electrical interconnection during assembly

• Published in: Journal of micromechanics and microengineering 2010-02, Vol.20 (2), p.025014-025014
• Main Authors: Lee, Yu-Tao, Lin, Chiung-Wen, Lin, Chia-Min, Yeh, Shih-Rung, Chang, Yen-Chung, Fang, Weileun
• Format: Article
• Language: English
• Subjects: Alignment; Applied sciences; Arrays; Assembling; Assembly; Carriers; Electronics; Exact sciences and technology; Glass; Instruments, apparatus, components and techniques common to several branches of physics and astronomy; Mechanical engineering. Machine design; Mechanical instruments, equipment and techniques; Microelectronic fabrication (materials and surfaces technology); Micromechanical devices and systems; Physics; Precision engineering, watch making; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Silicon; Three dimensional
• ISSN: 0960-1317; 1361-6439
• DOI: 10.1088/0960-1317/20/2/025014

This study presents a process for the assembling of a pseudo 3D glass microprobe array. A glass microprobe with embedded silicon (ES) is batch fabricated by a glass reflow process. The silicon fixture and carrier for the assembly are also batch fabricated by silicon micromachining processes. First, the chips with a glass microprobe array are bonded by parylene-C to form the pseudo 3D glass microprobe array. The pseudo 3D microprobe array is then mounted on the silicon carrier. ES is employed for alignment during the assembly, and also acts as the electrical routing for signal recording. In application, the impedance of this glass microprobe is measured, and at 1 kHz it is 1.1 M Delta *W. Action potentials from rat brain cortex are also successfully recorded.