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Experimental verification of temperature coefficients of resistance for uniformly doped P-type resistors in SOI

Many today's microsystems like strain-gauge-based piezoresistive pressure sensors contain doped resistors. If one wants to predict correctly the temperature impact on the performance of such devices, the accurate data about the temperature coefficients of resistance (TCR) are essential. Althoug...

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Published in:Journal of micromechanics and microengineering 2010-06, Vol.20 (6), p.064008-064008
Main Authors: Olszacki, M, Maj, C, Al Bahri, M, Marrot, J-C, Boukabache, A, Pons, P, Napieralski, A
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container_title Journal of micromechanics and microengineering
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description Many today's microsystems like strain-gauge-based piezoresistive pressure sensors contain doped resistors. If one wants to predict correctly the temperature impact on the performance of such devices, the accurate data about the temperature coefficients of resistance (TCR) are essential. Although such data may be calculated using one of the existing mobility models, our experiments showed that we can observe the huge mismatch between the calculated and measured values. Thus, in order to investigate the TCR values, a set of the test structures that contained doped P-type resistors was fabricated. As the TCR value also depends on the doping profile shape, we decided to use the very thin, 340 nm thick SOI wafers in order to fabricate the quasi-uniformly doped silicon layers ranging from 2 X 1017 at cm-3 to 1.6 X 1019 at cm-3. The results showed that the experimental data for the first-order TCR are quite far from the calculated ones especially over the doping range of 1018--1019 at cm-3 and quite close to the experimental ones obtained by Bullis about 50 years ago for bulk silicon. Moreover, for the first time, second-order coefficients that were not very consistent with the calculations were obtained.
doi_str_mv 10.1088/0960-1317/20/6/064008
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If one wants to predict correctly the temperature impact on the performance of such devices, the accurate data about the temperature coefficients of resistance (TCR) are essential. Although such data may be calculated using one of the existing mobility models, our experiments showed that we can observe the huge mismatch between the calculated and measured values. Thus, in order to investigate the TCR values, a set of the test structures that contained doped P-type resistors was fabricated. As the TCR value also depends on the doping profile shape, we decided to use the very thin, 340 nm thick SOI wafers in order to fabricate the quasi-uniformly doped silicon layers ranging from 2 X 1017 at cm-3 to 1.6 X 1019 at cm-3. The results showed that the experimental data for the first-order TCR are quite far from the calculated ones especially over the doping range of 1018--1019 at cm-3 and quite close to the experimental ones obtained by Bullis about 50 years ago for bulk silicon. 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source Institute of Physics:Jisc Collections:IOP Publishing Read and Publish 2024-2025 (Reading List)
subjects Applied sciences
Devices
Doping
Electronics
Exact sciences and technology
Fluid dynamics
Fundamental areas of phenomenology (including applications)
Instrumentation for fluid dynamics
Instruments, apparatus, components and techniques common to several branches of physics and astronomy
Mathematical models
Mechanical engineering. Machine design
Mechanical instruments, equipment and techniques
Microelectronic fabrication (materials and surfaces technology)
Microengineering
Micromechanical devices and systems
Micromechanics
Physics
Precision engineering, watch making
Pressure sensors
Resistors
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Silicon
title Experimental verification of temperature coefficients of resistance for uniformly doped P-type resistors in SOI
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