Revisiting mechanisms to inhibit Ag3Sn plates in Sn-Ag-Cu solders with 1 wt.% Zn addition

Saved in:
Bibliographic Details
Published in:Journal of alloys and compounds 2010-06, Vol.500 (1), p.39-45
Main Authors: LUO, Z.-B, ZHAO, J, GAO, Y.-J, WANG, L
Format: Article
Language:English
Subjects:
Cross-disciplinary physics: materials science
rheology
Exact sciences and technology
Materials science
Phase diagrams and microstructures developed by solidification and solid-solid phase transformations
Physics
Solidification
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:
ISSN:0925-8388
1873-4669
DOI:10.1016/j.jallcom.2010.03.191