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Interfacial Reaction Effect on Electrical Reliability of Cu Pillar/Sn Bumps : Phase Stability, phase transformation and reactive phase formation in electronic materials
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Published in: | Journal of electronic materials 2010, Vol.39 (11), p.2368-2374 |
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Main Authors: | , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Online Access: | Get full text |
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ISSN: | 0361-5235 1543-186X |