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Interfacial Reaction Effect on Electrical Reliability of Cu Pillar/Sn Bumps : Phase Stability, phase transformation and reactive phase formation in electronic materials

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Bibliographic Details
Published in:Journal of electronic materials 2010, Vol.39 (11), p.2368-2374
Main Authors: JEONG, Myeong-Hyeok, LIM, Gi-Tae, KIM, Byoung-Joon, LEE, Ki-Wook, KIM, Jae-Dong, JOO, Young-Chang, PARK, Young-Bae
Format: Article
Language:English
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ISSN:0361-5235
1543-186X