Effects on Undercooling and Interfacial Reactions with Cu Substrates of Adding Bi and In to Sn-3Ag Solder : Phase Stability, phase transformation and reactive phase formation in electronic materials

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Bibliographic Details
Published in:Journal of electronic materials 2010, Vol.39 (11), p.2397-2402
Main Authors: CHIANG, Yu-Yan, CHENG, Robbin, WU, Albert T
Format: Article
Language:English
Subjects:
Applied sciences
Brazing. Soldering
Electronics
Exact sciences and technology
Joining, thermal cutting: metallurgical aspects
Materials
Metals. Metallurgy
Online Access:Get full text
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ISSN:0361-5235
1543-186X