Loading…

Electrical evaluation of Cu contamination behavior at the backside surface of a thinned wafer by transient capacitance measurement

Saved in:

Bibliographic Details
Published in:	Semiconductor science and technology 2011-02, Vol.26 (2), p.025007
Main Authors:	Lee, K-W, Bea, J-C, Fukushima, T, Tanaka, T, Koyanagi, M
Format:	Article
Language:	English
Subjects:	Condensed matter: electronic structure, electrical, magnetic, and optical properties Electronic structure and electrical properties of surfaces, interfaces, thin films and low-dimensional structures Electronic transport in interface structures Exact sciences and technology Metal-insulator-semiconductor structures (including semiconductor-to-insulator) Physics
Citations:	Items that this one cites Items that cite this one
Online Access:	Get full text
Tags:	Add Tag No Tags, Be the first to tag this record!