S/390 cost performance considerations for MCM packaging choices

In this paper, we develop a cost performance metric for the comparison of MCM structures used for the packaging of the central electronic complex (CEC) of the S/390 systems. The approach is simple and general enough that it can be used to evaluate any first level package structure. The cost componen...

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Bibliographic Details
Published in:IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging packaging, and manufacturing technology. Part B, Advanced packaging, 1998-08, Vol.21 (3), p.286-297
Main Authors: Katopis, G.A., Becker, W.D.
Format: Article
Language:English
Subjects:
Applied sciences
Ceramics
CMOS technology
Costs
Delay
Electronics
Electronics packaging
Exact sciences and technology
Frequency
General (including economical and industrial fields)
Glass
High performance computing
Microprocessors
Polyimides
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Summary:In this paper, we develop a cost performance metric for the comparison of MCM structures used for the packaging of the central electronic complex (CEC) of the S/390 systems. The approach is simple and general enough that it can be used to evaluate any first level package structure. The cost component is based on relative costs for the structures examined, while the performance is estimated through closed form formulae and simulation data of actual products. The results of this comparison show that a glass ceramic MCM with polyimide redistribution is the package of choice for bus frequencies larger than 160 MHz. For bus frequencies less than 160 MHz, all alternatives examined are cost performance equivalent and the choice should be based on other criteria that are application specific.
ISSN:1070-9894
1558-3686
DOI:10.1109/96.704940