Electromagnetic Compatibility Benchmark-Modeling Approach for a Dual-Die CPU

The traditional challenging problem 2000-4 of electromagnetics (as indicated by the IEEE) proposed a benchmark model of a conventional CPU with a heatsink. However, after CPU entered the multiple-die century, the original model is no longer effective for the new generation multiple-die package. A no...

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Bibliographic Details
Published in:IEEE transactions on electromagnetic compatibility 2011-02, Vol.53 (1), p.91-98
Main Authors: Zhu, Boyuan, Lu, Junwei, Li, Erping
Format: Article
Language:English
Subjects:
Applied classical electromagnetism
Applied sciences
Benchmark testing
Benchmarking
Central processing units
Computational modeling
Computer simulation
CPU with heatsink
Design. Technologies. Operation analysis. Testing
dual die
Electromagnetic compatibility
electromagnetic compatibility (EMC)
electromagnetic modeling
Electromagnetic wave propagation, radiowave propagation
Electromagnetism
electron and ion optics
Electromagnets
Electronics
Exact sciences and technology
Fundamental areas of phenomenology (including applications)
Heat sinks
Heating
Information, signal and communications theory
Integrated circuit modeling
Integrated circuits
Integrated circuits by function (including memories and processors)
Mathematical models
Packages
Physics
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Substrates
Telecommunications and information theory
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Description
Summary:The traditional challenging problem 2000-4 of electromagnetics (as indicated by the IEEE) proposed a benchmark model of a conventional CPU with a heatsink. However, after CPU entered the multiple-die century, the original model is no longer effective for the new generation multiple-die package. A novel model is proposed in this paper for electromagnet radiation modeling of the CPU with dual dies as a new electromagnetic compatibility benchmark-modeling approach. The modeling method is validated by the measurement, and the simulation and measurement results showed a good agreement, and demonstrated it is an effective modeling technique.
ISSN:0018-9375
1558-187X
DOI:10.1109/TEMC.2010.2053208