Incorporation of in-plane interconnects to reflow bonding for electrical functionality

• Published in: Journal of micromechanics and microengineering 2011-07, Vol.21 (7), p.074002
• Main Authors: Moğulkoç, B, Jansen, H V, ter Brake, H J M, Elwenspoek, M C
• Format: Article
• Language: English
• Subjects: Applied fluid mechanics; Applied sciences; Biological and medical sciences; Biosensors; Biotechnology; Electronics; Exact sciences and technology; Fluid dynamics; Fluidics; Fundamental and applied biological sciences. Psychology; Fundamental areas of phenomenology (including applications); Instruments, apparatus, components and techniques common to several branches of physics and astronomy; Mechanical instruments, equipment and techniques; Methods. Procedures. Technologies; Microelectronic fabrication (materials and surfaces technology); Micromechanical devices and systems; Physics; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Various methods and equipments
• ISSN: 0960-1317; 1361-6439
• DOI: 10.1088/0960-1317/21/7/074002

Incorporation of in-plane electrical interconnects to reflow bonding is studied to provide electrical functionality to lab-on-a-chip or microfluidic devices. Reflow bonding is the packaging technology, in which glass tubes are joined to silicon substrates at elevated temperatures. The tubes are used to interface the silicon-based fluidic devices and are directly compatible with standard Swagelok® connectors. After the bonding, the electrically conductive lines will allow probing into the volume confined by the tube, where the fluidic device operates. Therefore methods for fabricating electrical interconnects that survive the bonding procedure at elevated temperature and do not alter the properties of the bond interface are investigated.