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Fabrication technique of a compressible biocompatible interconnect using a thin film transfer process

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Bibliographic Details
Published in:Journal of micromechanics and microengineering 2011-07, Vol.21 (7), p.074012
Main Authors: Aarts, A A A, Srivannavit, O, Wise, K D, Yoon, E, Puers, R, Van Hoof, C, Neves, H P
Format: Article
Language:English
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ISSN:0960-1317
1361-6439
DOI:10.1088/0960-1317/21/7/074012